TSMC

Yield Excellence Engineer (Phoenix, AZ On-site)

TSMC  •  Phoenix, AZ (Onsite)  •  2 hours ago
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Job Description

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate it’s leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

TSMC Arizona’s Yield Enhancement Department is responsible for Defect reduction, Yield improvement, and Inspection methodology excellence.

Your main responsibilities include:

  • Identifying potential yield-limiting defect sources; defining an aggressive defect reduction roadmap for the program and related modules; owning the results.
  • Using statistical process control principles to sustain production line health and prevent defect induced excursion events; working with module engineers to identify and eliminate process and station defect source; designing and executing experiments; interpreting and extracting insightful results from complex data sets to implement solutions in a timely manner.
  • Installing, qualifying and sustaining inline inspection and reviewing equipment to expand capability for inline defect detection.
  • Collaborating effectively with integration and process organization partners to identify technology gaps and deficiencies, evaluate and qualify mitigation and continuous improvement solutions.

Minimum Qualifications

Applicants must be legally eligible to work in the United States and have:

  • Bachelor's or higher degree in Electrical Engineering, Material Science.
  • Experience in bright field, darkfield and Ebeam defect metrology tool usage
  • Experience in inline usage of above tools to monitor/detect integrated and process tool shifts in a high volume 24/7 advance manufacturing fab
  • Passion for collaboration with process integration equipment in driving improvements
  • Good communication and interpersonal skills.
  • Able to work on cross-functional and geographically dispersed teams with diverse backgrounds.
  • Must take ownership for solving issues and ensures escalations take place.
  • A team player that can multitask and thrive in a very dynamic and fast-paced environment.

Interpersonal Skills:

  • Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
  • Able to take initiatives, adapt priorities and responsibilities to support business needs.
  • Hands-on participant with a strong sense of ownership.
  • Goal driven with demonstrated ability of working in a high performing team culture.
  • Quick assimilation to new technology.
  • Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.

Interpersonal Skills:

  • Standard work hours: Monday through Friday

Work Location Phoenix, AZ

Travel May require travel dependent on business needs.

Relocation assistance available

TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences.

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TSMC

About TSMC

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.

TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.

The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.

TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.

Industry
Hardware & Semiconductors
Company Size
10,000+ employees
Headquarters
Hsinchu, TW
Year Founded
Unknown
Website
tsmc.com
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