(中科)Wet etch溼蝕刻技術開發工程師
【工作內容】
作為華邦的(中科)Wet etch溼蝕刻技術開發工程師,你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:
1.熟悉先進溼蝕刻製程技術開發
2.建立/規劃與執行先進技術的標準化流程
3.工程相關process material之評估及規格訂定
4.工程相關機台設備評估及規格訂定
5.製程改善以提高process window
6.製程驗證,通過qualification並導入量產
【工作地點】 中科(台中市大雅區中部科學園區科雅一路8號)
【條件要求】
學歷要求:碩士
科系要求:化學工程相關 │ 化學相關 │ 材料工程相關
相關經驗:3年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1.12吋先進溼蝕刻製程相關經驗3年以上, 具製程開發經驗者佳.
2.熟悉DOE實驗設計, AI相關工具使用者為佳.

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.