Job Description

Sustain and optimize the Wafer Saw (Die Preparation) process to achieve high performance in yield, quality, cycle time, and cost, while ensuring robust process control and supporting capacity expansion.

• Own and sustain Wafer Saw / Die Preparation processes.
• Define, optimize, and control sawing parameters (blade type, feed rate, spindle speed, etc.)
• Drive yield improvement, defect reduction, and process capability enhancement
• Lead failure analysis related to chipping, cracking, contamination, and die defects
• Establish and maintain SPC controls, FMEA, and control plans
• Support new product introduction (NPI) and process qualification
• Identify and implement cost reduction and productivity improvements
• Evaluate and qualify materials, tooling, and equipment suppliers
• Lead continuous improvement projects and capacity expansion initiatives
• Ensure complete and accurate process documentation and standardization

• Bachelor’s Degree in Engineering (ME, EE, IE or equivalent)
• Minimum of 3 years Process Engineering experience in semiconductor manufacturing with hands-on experience in Wafer Saw / Die Preparation
• Strong knowledge of Wafer Saw processes, materials, and defect mechanisms
• Understands DFD6240, DFD6340/1, DFD6361/2, ADT2000, Laser Groove and other die preparation equipment.
• Proficiency in SPC, DOE, Data Analysis, FMEA, Control Plan and Change Management
• Solid problem-solving and root cause analysis (RCA) skills
• Ability to manage multiple priorities in a high-volume environment
• Strong technical ownership and decision-making capability
• Effective cross-functional communication and collaboration
• Experience in different FOL processes is an advantage