Job Description

Wafer Fabrication Integration Engineer

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The MEMS organization is looking for a Silicon Wafer Fabrication Integration Engineer. This role is responsible for the end-to-end integration of silicon wafer fabrication processes supporting new technology development and manufacturing readiness. This role drives process integration strategies across photolithography, deposition, etch, metrology, and other semiconductor fabrication modules to deliver robust, manufacturable, high-performing, and reliable products.

The engineer works closely with process engineering, product engineering, design, quality, reliability, operations, and worldwide manufacturing partners to identify risks, solve complex technical issues, and accelerate technology development through qualification and production readiness.

Responsibilities

• Define, develop, and optimize wafer process flows across multiple fabrication modules.
• Lead cross-functional teams to resolve integration, yield, reliability, and quality challenges.
• Drive characterization plans, design-of-experiments (DOE), process qualifications, and technology demonstrations.
• Evaluate interactions between process modules and identify integration risks, tradeoffs, and mitigation strategies.
• Support technology transfers to internal or external manufacturing sites.
• Lead technical reviews, integration meetings, and project execution plans.
• Collaborate with worldwide engineering teams to align process capabilities and manufacturing readiness.
• Provide technical leadership during fab escalations, root-cause investigations, and corrective action implementation

Education & Experience Recommended

• Bachelor’s or Advanced Degree in Material Science, Engineering, or Physical Sciences
• 5+ years of experience in semiconductor, MEMS, or microfabrication process development and integration.
• Strong understanding of semiconductor fabrication processes including photolithography, thin film deposition, dry and wet etch, cleaning processes, and metrology and defect inspection

Knowledge & Skills

• Demonstrated ability to solve complex technical problems using structured engineering methods.
• Experience with DOE, SPC, data analysis, and yield improvement methodologies
• Project management skills
• Strong written and verbal communication skills - ability to give clear and effective presentations to inform and persuade peers and managers
• Proven ability to work effectively in cross-functional and global teams.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal"