Ceva, Inc.

VLSI Backend Team Leader

Ceva, Inc.  •  Ra'anana, IL (Onsite)  •  5 days ago
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Job Description

About the Business Unit:

Ceva develops state-of-the-art DSPs, AI processors, and hardware-accelerator IP for AI, vision, wireless, and base-station applications. Our VLSI organization transforms advanced architecture into production-ready silicon IP across leading technology nodes.

About the Role:

We are looking for an experienced physical-design leader who wants to remain close to technology while leading an accomplished engineering team.

You will lead a team of experienced backend engineers across Israel and India and own delivery across multiple projects in parallel.

This hands-on leadership role combines approximately 50% technical work and 50% team management, with end-to-end responsibility for turning complex RTL into tape out-ready GDSII.

Responsibilities:

Own and drive the complete RTL-to-GDSII flow, including synthesis, implementation, timing closure, physical verification, signoff, and tape out-ready IP delivery.

Lead, mentor, and develop a distributed team of experienced engineers while setting priorities and ensuring predictable, high-quality execution.

Provide hands-on leadership in flow development, advanced technology-node bring-up, integration, automation, and complex design closure.

Partner with architecture, frontend, verification, and other stakeholders to remove technical roadblocks and continuously improve backend methodologies.

The role includes working closely with customers and supporting backend convergence of the IP.

Requirements

  • B.Sc. or M.Sc. in Electrical Engineering
  • At least 10 years of hands-on experience in VLSI backend or physical design
  • Proven managerial or team-lead experience and the ability to guide a highly experienced engineering team.
  • Deep knowledge of synthesis, place and route (P&R), static timing analysis (STA), physical verification, and signoff flows.
  • Proven ownership of complete RTL-to-GDSII execution for complex designs, including advanced process technologies of 7nm and below.
  • Strong TCL and Python scripting skills, together with excellent troubleshooting, communication, prioritization, and collaboration capabilities.

Advantages:

  • Top-level integration experience for a multi-partition SoC.
  • Strong understanding of RTL design using Verilog or SystemVerilog.
  • Experience developing physical-design flows, infrastructure, or advanced-node methodologies.
Ceva, Inc.

About Ceva, Inc.

Ceva is the leader in innovative silicon and software IP solutions

that enable smart edge products to connect, sense, and infer data more reliably and efficiently.

At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.

With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.

We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.

Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.

Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.

Industry
Hardware & Semiconductors
Company Size
201-500 employees
Headquarters
Rockville, Maryland
Year Founded
2002
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