Ceva, Inc.

VLSI Backend Team Leader

Ceva, Inc.  •  Ra'anana, IL (Onsite)  •  19 days ago
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Job Description

Are you an experienced VLSI physical design engineer with proven managerial capabilities and highly passionate about developing cutting edge technology? Then you belong with us!

Here at Ceva, we are developing state-of-the-art DSP, AI processors and HW accelerator ASIC projects in AI, Vision, Wireless, and Base-stations areas.

We are seeking a highly skilled and motivated VLSI Backend Team Leader to join and lead our dynamic team.

As part of this position, you will lead a team of experienced engineers working on parallel projects, and play a crucial role in the design and implementation of complex designs, flow development, and the latest technology node bring-up and integration.

The Backend team leader will be required to do 50% hands on work and 50% managerial work.

Requirements

  • B.Sc. / M.Sc. in Electrical Engineering from a leading institute
  • At least 10 years of experience as a VLSI Backend Engineer
  • In-depth knowledge of Synthesis, P&R, and STA flows
  • Hands-on experience of full RTL to GDS-II flow for complex designs
  • Experience in development in advanced nodes (7nm and below)
  • Experience in scripting using TCL and Python.

Advantage:

  • Previous managerial experience – not a must.
  • Top-level integration experience for multi-partition SOC.
  • In-depth knowledge of RTL (Verilog/System Verilog)

Personality

  • Self-motivated and self-directed, proactive
  • Ability to achieve results in a fast-moving, agile flow, and dynamic environment, both locally and across the organization
  • Ability to troubleshoot and analyze complex problems
  • Excellent communication skills, both verbally and in writing
  • Team player
Ceva, Inc.

About Ceva, Inc.

Ceva is the leader in innovative silicon and software IP solutions

that enable smart edge products to connect, sense, and infer data more reliably and efficiently.

At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.

With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.

We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.

Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.

Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.

Industry
Hardware & Semiconductors
Company Size
201-500 employees
Headquarters
Rockville, Maryland
Year Founded
2002
Website
ceva-ip.com
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