Job Description

Join our R&V team to support thermal design and simulation efforts for advanced semiconductor packaging test platforms. You may work on heat dissipation strategies and thermal modeling for PCBs, interposers, probe cards, and cooling solutions for the device under test.

Key Responsibilities:

Thermal Simulation & Analysis

· Perform thermal simulations (Convection/Conduction-based, steady-state/transient) to estimate heat dissipation across PCBs, Interposers, Test Thermal assemblies and probe cards.

Cooling Strategy Development

· Evaluate and propose cooling solutions (liquid cooling, heat sinks, air-cooled, zonal heaters) for advanced packaged devices.

Material & Interface Evaluation

· Research thermal interface materials (TIMs) and their impact on heat transfer efficiency.

Documentation & Reporting

· Prepare detailed thermal analysis reports and present findings in design reviews.

· Maintain organized documentation for future reference.

Cross-functional Collaboration

· Work closely with mechanical and electrical engineers to ensure thermal solutions align with fixture and test requirements.

Qualifications

Requirements:

• Pursuing BS/MS in Mechanical Engineering, Thermal Engineering, or related field.
• Strong fundamentals in heat transfer, thermodynamics
• Experience with thermal simulation tools is a plus (Solidworks, ANSYS Icepak, or similar), focusing on both steady-state and transient analysis.
• Familiarity with PCB design constraints and semiconductor packaging thermal challenges is a plus.
• Excellent problem-solving and communication skills.

Additional Skills Preferred (but not required):

• Familiarity with heaters, Peltiers, heatsinks, sockets, two-phase cooling, cryogenics, airflow uniformity, and condensation abatement.
• Familiarity with programming languages such as Matlab and Python

Experience in electronic packaging, automated handling, and integration of thermal systems is a plus.

NOTE: Benefits do NOT apply to interns.