Futurewei has opening for Thermal Engineer intern. Candidates will participate in cutting edge research in next-generation electronic devices and packages. This role focuses on heat transfer challenges in high-power and high-density electronics. The intern will have the opportunity to work alongside and learn from senior researchers to explore and develop new and impactful technologies.
Responsibilities
• Perform electronic package and system level thermal analysis.
• Design, develop, test innovative system-level cooling solutions.
• Analyze heat dissipation, temperature distribution, and thermal resistance in device structures, including interfaces and thin films.
• Assist in modeling thermal boundary conductance (TBC) and interfacial heat transport in heterogeneous material systems.
• Provide research input on early explorations: determine the scope of the problem, the best use of ML, and the merits of different approaches.
• Integrating latest research into applied projects.
• Prepare reports, manuscripts, proposals, and technical manuals for use by other scientists.
Qualifications
• Master’s degree, Ph.D. or Ph.D. candidate in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• Fundamental knowledge of nanoscale heat transfer and interfacial thermal transport concepts.
• Experience in performing thermal simulation.
• Experience in the thermal/mechanical design of electronic devices.
• Self-motivated detail-oriented team player.
• Good verbal and written communication skills. Have track record of publishing scientific papers.
Founded in 2001, Futurewei Technologies is dedicated to pursuing openness in Research & Development (R&D) by embracing Open Innovation Model. We strive to share ideas and knowledge with technology communities to open and new business opportunities.
Futurewei maintains ongoing, in-depth collaboration with forward-thinking companies around the world in multiple domains. Our experts have been actively engaged in standard programs throughout these past two decades.
We are active in open-source communities as part of our ongoing efforts to build out the industry and cultivate an ecosystem that promotes shared success, we participate the next generation standards for wireless and networks; and we building open ecosystems through open app platforms for ICT systems.
