Job Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• The Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages.
• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements.
• Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability.
• Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions.
• Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies.
• Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes.
• Manages assembly yield improvement and package cost reduction programs.

Qualifications

REQUIRED:

• Requires a candidate with MS degree in Mechanical/Materials Engineering
• Knowledge of semiconductor packaging highly desired

PREFERRED:

• Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required
• Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required

SKILLS:

• Preferred candidate will have worked on projects related to semiconductor packaging from both mechanical and electrical integrity perspective