onsemi is seeking a highly motivated Technology Development Manager or Senior Manager to lead the development, qualification, and high-volume manufacturing ramp of Embedded Power Module technologies at our East Fishkill, NY 300mm wafer fab.
This role is a critical leadership position within the Technology Development organization, with end-to-end accountability for developing onsemi’s advanced Embedded Power Module process and packaging concepts into qualified, manufacturable, and competitive products aligned with onsemi’s long-term technology and business roadmaps.
The successful candidate will lead a team of experienced development engineers and will serve as a key technical and organizational interface across Business Units, Product Engineering, Manufacturing, Operations, Packaging, Reliability, Finance, external partners, and executive leadership.
People & Organization Leadership
• Manage and develop a team of approximately 5–15 engineers.
• Build a high-performance engineering culture and support talent development and succession planning.
Technical & Technology Ownership
• Serve as overall technical leader for Embedded Power Module technology development, qualification, and ramp.
• Own technical readiness across process integration, yield, reliability, and manufacturability.
Program Execution & Delivery
• Lead and deliver multiple concurrent technology development programs aligned with global corporate technology development and manufacturing requirements.
• Partner with program and product management to transition technologies into high-volume production.
Cross-Functional & Executive Engagement
• Act as primary interface with internal stakeholders and external partners.
• Communicate technical and program status to senior and executive leadership.
QUALIFICATIONS
• M.S. degree or higher in engineering (PhD preferred).
• Extensive semiconductor industry experience (typically 15+ years).
• Strong leadership, communication, and cross-functional collaboration skills.
Preferred
• Deep knowledge of power modules, ICs, advanced packaging, and backend processing.
• Experience with Cu plate-up, RDL via etch, encapsulation, pick-and-place, sinter attach, and HV testing is desired.
Salary: onsemi is excited to share the base salary range for this position is$147.000 to $250,000 exclusive of fringe benefits or potential bonuses.The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Learn more about onsemi at www.onsemi.com.
