Job Description

Die Bond Process Technician is responsible for operating, setting up, and maintaining die attach equipment to ensure accurate and reliable placement of semiconductor dies onto leadframes or substrates. The role requires fundamental knowledge of die attach processes, materials (epoxy, eutectic, solder), and machine principles such as vacuum, temperature, force, and precise alignment (X‑Y‑θ). The technician performs routine inspections, monitors process stability using basic SPC methods, and identifies common defects like die shift, tilt, and voids. They are also responsible for basic troubleshooting of machine alarms, executing recovery actions, and escalating complex issues when required. Adherence to work instructions, safety standards, ESD control, and cleanroom protocols is essential. The position demands strong discipline, attention to detail, effective communication, and the ability to work in a high-volume, shift-based manufacturing environment while supporting continuous improvement in quality and productivity.

Process Setup & Optimization

• Set up diebond machine parameters according to product requirements
• Assist Engineer to develop, fine-tune, and optimize bonding recipe (temperature, force, time, alignment)
• Support new product introduction (NPI) and process qualification
• Ensure correct type data/wafer data/bond data configuration and tools use.

Machine support & Maintenance

• Provide technical support to production for die bond machines.
• Perform machine buy-off, setup verification and readiness checks.
• Buyoff the preventive maintenance (PM) and calibration with equipment team.
• Validate tooling condition (Collet, needle, eject pin) for optimal performance.

Process Control & Monitoring

• Monitor key process parameter and ensure stability
• Analyze SPC data and take corrective action on process drift
• Maintain process control within defined specifications (CPK, yield targets)
• Conduct lot to lot and shift to shift performance monitoring and lot disposition.

Yield & Quality Improvement

• Assist Engineer to perform root cause analysis (RCA) and work on improvement action
• Assist Engineer to drive continuous yield improvement activity
• Support customer complaintes and internal quality issues.

Troubleshooting & Problem solving

• Lead technical troubleshooting for machine and process issues.
• Diagnose alarms such as pick/place errors, vacuum issue and alignment failure
• Define and implement containment and recovery actions
• Escalate critical issues and propose long term solutions.
• Diploma in any relevant discipline.
• Familiarity with high tech or semiconductor industry will be a plus, but not a mandate.
• 5+ years’ experience relevant experience in Die bond process.
• Problem-solving mindset with a willingness to roll-up sleeves and get the job done.
• Results-driven mindset with strong analytical skills and demonstrated success working with cross-functional stakeholders
• Robust knowledge of Microsoft Office applications including Excel, PowerPoint, Word

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits