Job Description

Job Summary

HCLTech is seeking an experienced ATMP Equipment SME to support the growth of its OSAT/ATMP Equipment Engineering business. The individual will serve as a subject matter expert for backend semiconductor manufacturing and advanced packaging technologies, supporting customer engagements, solution development, delivery excellence, and capability building across semiconductor manufacturing programs.

Key Responsibilities

• Act as the technical SME for OSAT/ATMP equipment engineering opportunities.
• Support customer discussions, technical workshops, proposals, RFIs, RFQs, and solution development.
• Prvide domain expertise for equipment installation, qualification, acceptance testing, and sustaining engineering activities.
• Support advanced packaging and backend manufacturing programs for global semiconductor customers.
• Develop reusable assets, deployment methodologies, SOPs, and best practices.
• Mentor engineers and support competency development within the Semiconductor Manufacturing organization.
• Work closely with OEMs, customers, delivery teams, and ecosystem partners to resolve technical challenges.
• Support the development of managed services and multi-shift delivery models for ATMP equipment support.

Skill Requirements

• 8-12 years of experience in Semiconductor Manufacturing, OSAT, ATMP, or Equipment Engineering.
• Strong expertise in Die Attach, Wire Bond, Flip Chip, Molding, Dicing, Test Equipment, or Handlers.
• Experience in equipment installation, qualification, troubleshooting, maintenance, and production ramp support.
• Strong understanding of semiconductor packaging and assembly processes.
• Customer-facing experience with strong communication and stakeholder management skills.

Other Requirements

• Experience in 2.5D/3D Packaging, Fan-Out Packaging, TCB, Hybrid Bonding, and HBM Packaging.
• Experience with ASMPT, K&S, Besi, DISCO, Advantest, or Teradyne equipment platforms.
• Exposure to Greenfield OSAT/ATMP setup and commissioning.
• Experience supporting high-volume manufacturing environments.