Ceva's AI Division develops advanced AI processor architectures and technologies powering the next generation of intelligent devices.
Our R&D spans NPUs, Vision DSPs, AI algorithms, embedded software, and development tools, enabling efficient edge AI inference across automotive, smart cameras, mobile, and more.
We bring together hardware architecture, VLSI, software, and system engineering to deliver innovative, high-performance, and power-efficient AI solutions to leading semiconductor companies worldwide.
We are looking for an experienced Technical Program Manager to lead complex, multidisciplinary development programs within Ceva’s AI Division.
In this role, you will drive the development of advanced AI processor IP products, coordinating hardware, embedded software, development tools, and system-level activities from initial requirements through customer delivery.
You will work closely with engineering leaders, architects, product management, and customer teams to turn technical objectives into executable plans and ensure successful delivery.
You will also shape and improve our R&D development processes, driving greater predictability, efficiency, and quality across the organization.
Own end-to-end planning and execution of AI processor IP programs spanning hardware, embedded software, and development tools, from requirements through customer release.
Build and manage integrated plans, milestones, resources, and cross-functional dependencies.
Identify critical paths and risks, manage scope and trade-offs, and drive timely resolution of issues.
Lead multidisciplinary programs involving 30+ engineers across architecture, RTL design, verification, firmware, compilers, software tools, and system validation.
Partner with R&D managers and technical leaders to align priorities, resources, and plans across teams and global sites.
Ensure synchronization between hardware development, software readiness, and customer integration.
Define and continuously improve R&D program management processes and development methodologies.
Introduce practical planning, tracking, and release-readiness practices, including clear KPIs and quality gates.
Streamline cross-team workflows and reduce execution bottlenecks.
Serve as the central coordination point between R&D, product management, leadership, and customer-facing teams, communicating progress, risks, and key decisions clearly.
Ensure alignment between internal development plans and customer commitments.
Why Join Us?
Take a central role in developing advanced AI processor technologies for next-generation intelligent products.
Work at the intersection of hardware, software, and AI, with global teams and leading semiconductor companies.
Influence both product delivery and how complex R&D programs are run, with broad ownership and real impact.
Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.
