Job Description

Locations: Hsinchu, Taiwan

Categories: Engineering

Req ID: 91915

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE:

We are looking for an experienced Product Engineer to lead the end-to-end product lifecycle for datacenter hardware, GPU servers, and board-level products — from first-article validation through mass production ramp. This role serves as the critical bridge between hardware R&D and our ODM/CM manufacturing partners, holding end-to-end ownership of product quality, yield, and delivery timelines from design through mass production, as the company scales in the fast-growing AI server market.

THE PERSON:

The ideal candidate has strong ownership and a hands-on, floor-level mindset, staying calm and decisive under the pressure of a fast-moving, high-stakes production environment. You're able to balance engineering detail with business priorities, and you communicate effectively across hardware, firmware, and software R&D teams as well as with ODM/CM engineering counterparts. You take full, closed-loop ownership of product issues and follow them through to resolution, rather than staying confined to a single process step or station. You're data-driven, skilled at root cause analysis, and motivated to build standardized processes that support global mass production. Strong English communication skills, with the ability to work directly with overseas manufacturing partners, are a plus.

KEY RESPONSIBILITIES:

• Drive the NPI lifecycle for datacenter hardware, GPU servers, and board products from first-article validation to mass production ramp, holding end-to-end accountability for product quality and delivery timelines.
• Participate in early-stage hardware design reviews to provide DFM (Design for Manufacturing) / DFT (Design for Test) feedback, optimizing production quality and first-pass yield (FPY).
• Collaborate closely with ODM/CM engineering teams to resolve real-time production issues, enhance yield, and reduce manufacturing costs — acting as the product-side point of contact to coordinate communication and decisions.
• Define hardware test requirements, analyze test failures, and guide factory teams in debugging complex PCBA and server platform issues through failure analysis (FA).
• Forecast and plan required production test equipment, tooling, and factory capacity based on product complexity and program timelines.
• Interface cross-functionally with hardware, firmware, and software R&D teams; author and maintain global-ready SOPs and test specifications, ensuring consistency and traceability from R&D through mass production.

PREFERRED EXPERIENCE:

• 3+ years of Product Engineering or NPI experience with servers, GPU/AI computing platforms, or datacenter hardware.
• Familiarity with mass production workflows and test strategy for PCBA and server motherboard/system integration, with hands-on experience owning quality, yield, and cost from a product-level perspective.
• Hands-on experience with DFM/DFT reviews, partnering with R&D teams to deliver actionable design optimization feedback.
• Prior experience partnering with ODM/CM manufacturers strongly preferred, with the ability to independently manage cross-site, cross-team coordination and issue escalation.
• Working knowledge of yield analysis and failure analysis tools and methods (e.g., FA lab, X-ray, ICT/FCT testing), with the ability to translate findings into actionable product improvements.
• Experience with capacity planning and equipment/tooling deployment to support fast production ramps.
• Strong written and verbal English communication skills, including the ability to author English-language SOPs and communicate directly with overseas teams.
• Experience working across time zones on multinational project teams is a plus.

ACADEMIC CREDENTIALS:

• Bachelor's degree in Electrical Engineering, Electronic Engineering, Mechanical Engineering, Industrial Engineering, or a related technical field; Master's degree preferred.
• Relevant industry certifications (e.g., Six Sigma, PMP) are a plus but not required.

LOCATION:

Hsinchu, Taiwan

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Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.