Job Description

• Serve as the primary technical and quality interface to OSAT partners, driving alignment on quality expectations, manufacturing capability, and long‑term improvement roadmaps.
• Lead the development and execution of supplier quality strategies that strengthen backend manufacturing performance and reduce risk across the supply chain.
• Influence supplier leadership and internal stakeholders to prioritize quality, reliability, and continuous improvement initiatives.

• Provide deep technical oversight of OSAT assembly and test processes, including die attach, wire bond, flip‑chip, molding, underfill, singulation, and final test.
• Evaluate supplier process capability, equipment readiness, and control methodologies to ensure robust, scalable manufacturing for both mature and advanced packaging technologies.
• Guide suppliers in implementing best‑in‑class process controls, statistical methods, and reliability practices.

• Lead complex, cross‑functional problem‑solving efforts for systemic supplier issues, excursions, and customer‑impacting defects.
• Drive rigorous root cause analysis and ensure durable corrective and preventive actions are implemented and verified.
• Anticipate potential failure modes and proactively implement risk‑mitigation strategies across the supply base.

• Conduct in‑depth technical audits focused on assembly/test capability, reliability performance, quality systems, and process maturity.
• Develop and execute supplier improvement plans that elevate process capability, yield, and reliability performance.
• Mentor suppliers on quality methodologies, reliability expectations, and advanced packaging requirements.

• Drive initiatives that elevate supplier capability and reduce variability.
• Identify and implement innovative approaches to improve backend quality, reliability, and operational efficiency.

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical field.
• Minimum 8 years of experience in semiconductor manufacturing, supplier quality, assembly engineering, packaging engineering, or OSAT management.
• Deep technical knowledge of backend assembly and test processes, including die attach, wire bond, flip‑chip, molding, underfill, singulation, and final test.
• Strong understanding of packaging materials (substrates, leadframes, molding compounds, solder balls, adhesives) and their impact on reliability and yield.
• Proven experience directly interfacing with OSAT engineering teams and driving supplier‑level corrective actions, process improvements, and capability upgrades.
• Demonstrated expertise in quality and reliability methodologies: SPC, DOE, FMEA, MSA, 8D, PFMEA, APQP, PPAP.
• Strong analytical skills with the ability to interpret yield data, SPC charts, FA reports, and reliability results to drive decisions.
• Excellent communication, negotiation, and leadership skills, with the ability to influence both internal teams and supplier leadership.