Job Description

Join us in shaping the future of connected devices by developing advanced test solutions for next-generation IoT products. Work on silicon bring-up, ATE hardware and test program development, and Digital, Mixed-Signal, PMU, NVM, and RF technologies. Collaborate with global engineering teams to deliver high-quality, cost-efficient semiconductor solutions for volume production.

Your role

Key responsibilities in your new role

• Develop, implement, and maintain comprehensive test plans for next-generation IoT devices.
• Design, validate, debug, and improve ATE (Automated Test Equipment) hardware to ensure robust and reliable testing.
• Perform silicon bring-up and debug activities on ATE platforms for new semiconductor products.
• Drive high-quality, cost-efficient test solutions suitable for volume manufacturing.
• Coordinate and oversee test hardware and software activities with internal teams and external test houses.
• Develop, optimize, release, and support production test programs at offshore manufacturing sites.
• Provide technical expertise and troubleshooting support related to semiconductor test engineering for internal and external stakeholders.
• Develop and debug characterization and production test programs for SoC connectivity products incorporating Digital, Mixed-Signal, PMU, NVM, and RF blocks.
• Collaborate closely with cross-functional teams including IP Design, Applications Engineering, DFT, Product Engineering, and Test Engineering across global development sites.

Your profile

Qualifications and skills to help you succeed

• Bachelor's or Master's degree in Electronics & Communication Engineering (ECE), Electrical & Electronics Engineering (EEE), or related disciplines.
• Required Skills & Experience
• Strong understanding of semiconductor fundamentals, including analog and digital circuits, device physics, and circuit theory.
• Sound knowledge of Design-for-Test (DFT) methodologies, including ATPG and PMU-related blocks such as BUCLK and LDO trimming techniques.
• Hands-on experience with semiconductor testing methodologies using Teradyne UltraFLEX RF platforms; experience with UltraFLEX+ is a strong advantage.
• Proficiency in developing, debugging, and optimizing ATE test programs and resolving hardware-related issues.
• Strong programming and scripting skills in languages such as Python, Perl, C, C++, Java, or Visual Basic.
• Familiarity with UNIX/Linux operating systems, shell scripting, and command-line environments.
• Excellent problem-solving, analytical, and debugging capabilities.
• Strong verbal and written communication skills.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Anand Rawal