Job Description

To serve as the technical expert in transfer molding processes by driving process optimization, improving product quality, and ensuring stable and efficient production performance. The role is responsible for troubleshooting complex molding issues, supporting new product introduction, and implementing continuous improvement initiatives.

• Optimize molding process parameters to ensure stable, repeatable, and high-quality production output
• Diagnose and resolve molding defects (e.g., flash, mold bleed, package cracking, warpage) through systematic troubleshooting
• Lead root cause analysis and implement effective corrective and preventive actions (CAPA)Support mold trials, qualification, and New Product Introduction (NPI) activities to ensure smooth ramp-up
• Collaborate closely with tooling, quality, and production teams to drive process improvements
• Develop, standardize, and maintain molding process specifications and technical documentation
• Monitor key performance metrics and drive improvements in yield, cycle time, and scrap reduction
• Lead and execute continuous improvement initiatives using Lean and Six Sigma methodologies
  

• Must be either graduate in the field of BS in Mechanical or Electronics & Communications or Chemical Engineering, or equivalent.
• More than 10 years of experience in molding process.
• Proven hands-on experience with transfer molding equipment (e.g., TOWA, FUSEI)
• Strong knowledge of Epoxy Molding Compound (EMC), including material properties and processing behavior
• Extensive familiarity with semiconductor package molding processes, including transfer molding, IC encapsulation, and discrete/power device packaging
• Demonstrated expertise in troubleshooting complex molding issues and driving process optimization to improve yield, quality, and cycle time
• Strong analytical and problem-solving capabilities with a data-driven approach
• Effective communication and collaboration skills, with the ability to work across cross-functional teams