Job Description

Responsibilities:

• Define & deploy new component technology platforms in a cross-functional team for new product applications through testing, simulation, and prototypes.
• Qualification of components for use in surface-mount electronic assembly manufacturing processes.
• Use systematic problem-solving approaches to resolve quality/performance issues with suppliers, development, and manufacturing teams.
• Lead testing and validation of components for high-reliability applications by performing use case-based electrical and environmental stress tests.
• Implementation tasks include leading stage-gate approvals, documentation, supplier quality interface, characterization, verification, and ongoing sustaining support in a highly automated manufacturing environment.

Qualifications:

Education / Experience Requirements:

• B.Sc. or M.Sc. in Electrical Engineering, Applied Physics, Material Science, or equivalent physical science, with evidence of high academic achievement
• Excellent written and verbal communication skills; detail-oriented
• 3+ years of experience with chip-scale packaging, direct bump attach, copper pillar, and similar technologies
• Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach, their materials, and processes.
• Detailed knowledge of IC packaging failure modes and root cause analysis techniques
• Experience in high high-reliability electronics manufacturing environment
• Experience with quality systems, including technical writing of quality-relevant documentation
• Strong physics-based reasoning
• Experience with failure analysis and root cause corrective action with suppliers
• Demonstrated ability to conceive, implement, and complete engineering projects and experiments on schedule
• Proficiency in standard office productivity software (Excel, Word, PowerPoint, etc.)
• Demonstrated ability to interface across multiple functions/organizations (Quality, Manufacturing, Supply Chain, Test, Module/System development) to drive closure on projects.
• Demonstrated creativity with multiple examples of innovative solutions. U.S. or EU Patents desirable.