Job Description

About the Role

Our client, a leader in high-performance analog semiconductors, is at the forefront of the wireless networking industry. With a comprehensive portfolio and deep technical expertise, they are dedicated to connecting people and devices, everywhere, anytime. This role offers the chance to be involved in all stages of product development—from product definition and architecture to circuit design, multi-chip module (MCM) design, layout, testing, and production support. As a central figure in front-end module (FEM) design, you’ll drive front-end architecture and work closely with a multidisciplinary team to develop power amplifiers, RF switches, LNAs, and acoustic filters that deliver optimal performance for the high-demand cellular handset market.

Key Responsibilities

• Engage with customers to discuss I/O pin configurations, package size, and performance specifications, offering informed suggestions and solutions.
• Lead floor-planning, including module pinouts, package size and technology, signal flows, and link budget.
• Provide strategic input on new technologies and architectures with thorough analysis.
• Develop and enhance FEM design methodologies to boost accuracy and efficiency.
• Lead module design reviews and manage the tapeout process.
• Participate in new package technology development, offering insights and support.

Qualifications

Required:

• Strong foundation in RF/microwave principles, including impedance matching, passive RLC and resonant circuits, noise, linearity, circuit stability, and electromagnetic theory.
• Solid understanding of module building blocks, such as Power Amplifiers, Low Noise Amplifiers, RF Switches, Couplers, Filters, and Multi-chip Modules (MCM).
• Relevant experience with micro-strip/stripline stack-ups, MCM design, PA, LNA, RF switches, or passive circuit components (e.g., integrated passive devices, couplers, BAW/SAW filters, and baluns).
• Proficient in circuit simulation tools like Agilent ADS and 2.5D/3D EM tools (ADS Momentum/EMX, HFSS, and Cadence) with the ability to integrate models, simulations, physical designs, and measured performance.
• Proven lab skills in data collection, analysis, debugging, tuning, and product troubleshooting.
• Self-motivated team player with a strong commitment to taking products from concept to high-volume production.
• Excellent communication skills and logical reasoning abilities; adept at problem-solving, priority-setting, progress reporting, and adhering to schedules.
• Master’s degree in Electrical Engineering and at least three years of experience.

Preferred:

• Familiarity with RF systems and wireless standards such as 3GPP cellular 2/3/4/5G/LTE, WiFi, GPS, and Bluetooth.
• Strong understanding of device and process technologies.
• Experience in system architecture, circuit topology, and MCM floor planning.
• Background in FEM product development and customer interaction.
• Knowledge of acoustic filters, including SAW and BAW filters.
• Experience in co-simulation of digital, analog, and RF circuits.
• Proficiency with lab instruments like Network Analyzers, Spectrum Analyzers, Signal Generators, RF Probe Stations, Noise Figure Analyzers, and Load-pull Tuners.

Compensation and Benefits

Starting base pay will be based on relevant experience, skills, education, market demands, business needs, job responsibilities, and location. The client offers competitive base pay, healthcare options (including premium-free medical plans), a 401(k) plan with company match, an employee stock purchase plan, and paid time off (vacation, wellness days, parental leave). Incentive plans, as well as recognition and stock awards based on individual and/or company performance, may also be available for certain roles.