Job Description

Develop, sustain, and improve process yield for die attach, wirebond, inspection tools and/or process steps in the assembly of monolithically integrated optical circuits in 24x7 manufacturing and development facility. Focus on both process and tool ownership, process, equipment performance (MTBA, MTBF) and NPI.

Responsibilities include

• Become a process owner of many specific COC assembly processes, primarily wirebond and eutectic die attach.
• Peer-lead and develop expertise in specific assembly process modules as well as across the manufacturing process flow.
• Organize, analyze, and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.
• Identify and reduce components of variability by conducting controlled experiments, analyzing, summarizing, and presenting results.
• Work in a team environment consisting of engineers, technicians and operators.
• Create written operational procedures and mentor/train operators.
• Responsible for New Tool selection , procurement , installation, and qualifying new tools.
• Work with development and other functional teams to define the assembly requirements for new product introduction.
• Identify, develop, and qualify new assembly processes and technologies to enable and support next generation product needs.
• Represent Assembly Engineering in various multi-functional teams.
• Work in a clean room environment and follow strict clean room requirements.
• Must be available for 24/7 factory on call.

Skills / Experience / Knowledge

• Strong hands-on background in assembly technologies and processes for microelectronics manufacturing
• Hands-on operation and maintenance of assembly process tools and metrology equipment
• Technical expertise and ownership in die attach via solder or epoxy bonding on Micron2/Datacon EVO tool platform.
• Wafer fab or Assembly shop floor control systems
• Process engineering statistics background (SPC, DOE)
• Experience with Failure Analysis
• Material and Tool selection
• Plasma cleaning equipment and process
• Troubleshooting and resolving equipment problems
• Hands-on data analysis with JMP, MATLAB, or similar packages
• Experience in mentorship and training of operators, engineering technicians, and junior engineers
• Ability to work closely and coordinate activities with other functional groups.
• Good communication and project management skills
• Safety and quality-oriented mindset
• Knowledge & Experience
• Bachelor’s degree in electrical, Mechanical, Materials Engineering, or related field, plus 8 years of related experience, or master’s degree with 5 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.

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If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.