Job Description

Type:

• Direct Hire

Full Time or Part Time:

• Full-Time

Pay Rate:

• TBD

Location:

• Kissimmee, FL 34744

Language Requirements:

• Write, read, and speak English fluently.

Language Preferences:

• N/A

We are looking for a Senior Process Development and Integration Engineering lead for our Florida Advanced Packaging site. In this role you will lead, transfer, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform for Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with customers, colleagues, and management.

Your responsibilities will include: New process development/transfer/integration for FOWLP technology in a manufacturing environment; Lead or provide technical guidance to one or more teams for process integration or transfer advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications; Investigate and drive integration changes for improved device performance and yield improvement; Lead a team of process integration and tool engineers to find processing marginalities and make improvements; Directly interface with customers as a technical leader and expert in advanced FOWLP architectures; Act as technical lead and project manager integrating customer device requests with team activities. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

If selected, you will be working in an exciting environment where the brightest semiconductor minds come together to achieve exceptional results.

Experience Requirements:

• Experience with 2.5D/3D heterogeneous integration technologies such as FOWLP, SoIC, CoWoS, WoW, InFO, WLCSP and/or other chiplet/SiP architectures.

• Demonstrated leadership experience in guiding cross-functional teams and driving technical excellence.

• Awareness of packaging roadmaps and business models across heterogenous integration commercial landscape.

• Experience with wafer bumping, package assembly, substrate technology, testing and product development lifecycle.

• MEMS, Photonics or CMOS device and packaging knowledge (or similar) with relevant combination of years of experience (10+ years) and/or advanced degree.

• Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.

• Demonstrated project management skills and/or defined training and relevant experience.

• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.

• Demonstrated experience with customer interfacing to solve problems and transfer processes.

• Can work both independently and lead cross-functional teams for problem solving and process transfer.

• US Citizenship Required: All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

Experience Preferences:

• N/A

Physical Requirements:

• Ability to lift light equipment or materials, generally up to 20-30 pounds.

• Adequate vision to perform tasks effectively, including close and distance work.

• Good hearing ability to effectively communicate and respond to auditory cues.

• Capacity to perform repetitive tasks consistently with minimal breaks, demonstrating endurance and stamina throughout the work shift.

• You will be based in Kissimmee, Florida but open to travel abroad for technical discussions, training and brainstorming.

Education Requirements:

• BS Engineering, Physics, Electrical Engineering, Materials Science or equivalent.

Education Preferences:

• MS/PhD preferred.

Training Schedule:

• TBD

Schedule:

• TBD

Dress Code:

• Business Casual

Benefits:

• We offer competitive salary and financial benefits, such as bonuses, life insurance, 401k match, and opportunities to buy company stock at a discounted rate. We provide benefits that promote a healthy life, such as, comprehensive benefits package including benefit eligibility day one, paid time off, paid holidays, an on-site fitness facility, an on-site, self-serve market and so much more!

Additional Information:

Drug screening, background and reference checks are performed if required. Valid identification and reliable transportation required. We are an E-Verify employer. We will provide the Social Security Administration (SSA) and, if necessary, the Department of Homeland Security (DHS), with information from each new employee’s Form I-9 to confirm work authorization. Our employees are authorized to work in the United States.