Job Description

We are seeking a highly accomplished Senior Director to lead our SiGe Analog/RF/Mixed-Signal ASIC development team.

This role requires demonstrated strategic leadership in managing complex projects and a deep technical expertise in high-performance, high-frequency, and low-noise broadband analog & RF circuit/chip design, including TX (MZMD), RX (TIA), and supporting circuits.

The ideal candidate will possess extensive experience in leading diverse technical teams, fostering innovation, and driving product development from definition through design and production in a fast-paced environment.

• Lead and mentor the Analog/RF ASIC Design Team, overseeing product definition, chip architecture, design, foundry selection/interactions, test, and productization.
• Strategically manage and scale the team to deliver cutting-edge Analog/RF ASIC solutions crucial for Nokia’s optical engine development.
• Implement and enforce robust design methodologies and processes to ensure the highest product quality and reliability.
• Drive the exploration and selection of optimal circuit topologies to achieve market-leading product performance.
• Collaborate with cross-functional teams to define comprehensive product requirements and development roadmaps.
• Lead interactions with internal and external partners on foundry processes, packaging, test, and qualification efforts.
• Oversee the complete IC/Chip product development lifecycle, including specification, design, layout, tape-out, silicon bring-up, test, and reliability.
• Partner closely with verification, CAD, product, and test engineering teams to devise and execute comprehensive DVT plans and characterization.
• Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 15 years of progressive experience in Analog/RF ASIC design and leadership.
• Proven track record of analog/RF/mixed-signal SiGe BICMOS, CMOS ICs first-pass success in design leading to productization.
• Demonstrated experience in leading and developing high-performing, diverse technical teams.
• Extensive knowledge in high-speed, high-performance, low-noise Analog/RF circuitry.
• Strong understanding of Analog/RF/mixed signal layout techniques and best practices.
• Solid understanding of 3D EM simulation tools.
• Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs.
• Strong understanding of package and board-level design optimization.
• Fluent in verbal and written communications.
• Demonstrated ability to independently resolve complex organizational and technical challenges.
• Highly self-motivated, detail-oriented, and results-driven.
• Strategic cross-functional leadership.
• Strategic thinking and business acumen related to product roadmaps and market trends.
• Strong problem-solving and decision-making capabilities.