Job Description

1. Ensure high-quality and accurate implementation
Responsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework.
2. Manage and reduce configuration risks
Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production.
3. Drive efficient project execution
Ramp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects.
4. Collaborate across cross-functional teams
Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently.
5. Support yield improvement and operational performance
Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency.
6. Ensure project continuity and long-term ownership
Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership.

Requirements:

Basic Qualifications:

• At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer.
• Master’s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering.

Technical and Analytical Skills:

• Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies.
• Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA).
• Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning.
• Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks.

Quality and Customer Interface Experience:

• Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why.
• Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions.

Communication Skills:

• Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams.
• English proficiency equivalent to TOEIC 600 or above.

Systems and Manufacturing Knowledge

• Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.

More information about NXP in Greater China...

#LI-2370