The Packaging EDA group automates and standardizes the flows behind RF and AMS module packaging and the back-end IC wafer flows that feed them—spanning design-to-die, wirebond/bump interconnect, substrate routing, EM-aware layout, DRC/signoff, and the post-tapeout data that drives manufacturing. We are expanding beyond our traditional Cadence Allegro/APD SKILL and DRC automation into modern software engineering: Python-based tooling, database-driven workflows, and web-based enterprise platforms that manage data across the full IC lifecycle, from floorplanning to material-in-hand.

This is a hybrid role for a software developer who has worked in the Packaging/IC realm. Day to day, you may be asked to support active packaging and wafer-flow activities while also designing and building the long-term software solutions that will replace today's manual and spreadsheet-based processes. The balance between hands-on support and platform development will evolve over time, so we're looking for someone adaptable who is comfortable moving between immediate problem-solving and longer-term engineering.

The core technical need is Python, database, and web-application expertise to modernize existing spreadsheet- and VBA-based wafer flows into maintainable, connected platforms. Packaging-layout automation and tool experience (SKILL/APD) is a strong plus as design work will need to be supported by multiple members of our team, and we lean on AI-assisted development to extend it. You'll partner closely with a domain expert who owns the IC wafer flows and deep process knowledge, translating that expertise into robust, scalable software.

Responsibilities

• Design and build Python applications and web-based enterprise platforms that support the packaging and wafer-flow lifecycle, replacing spreadsheet/VBA solutions with maintainable, database-connected systems.
• Lead the conversion of an existing VBA solution into a web-based platform that:
  • communicates with multiple databases,
  • provides UIs for pre-tapeout (pre-TO) inputs,
  • supports a "shopping cart"–style workflow for post-TO interactions, and
  • runs automated triggers and DRCs throughout the IC lifecycle (floorplanning to material-in-hand).
• Develop automation for post-TO data gathering to support bump mask generation.
• Generate mechanical data for wafer probing.
• Support day-to-day packaging and wafer-flow activities as needed, balancing immediate operational needs with long-term development.
• Build and maintain packaging DRC rule decks and custom checks for module substrates, interposers, and system-in-package structures.
• Develop automation flows for AMS/RF module packaging (placement, routing, via strategies, stack-up) and repetitive tasks such as pin assignment, fanout, shielding patterns, and BOM generation—using Python, SKILL, or Tcl as appropriate.
• Manage code and collaboration through GitHub using a Gitflow-style branching model (feature branches, pull requests, code review), and leverage AI-assisted development (Cursor) to accelerate delivery.
• Collaborate cross-functionally with design, packaging, wafer-flow, test, and manufacturing teams to bridge domain knowledge into reliable tooling.
• Document flows, train users, and drive continuous improvement in cycle time, data integrity, and first-pass success.

Required Experience and Skills

• M.Tech/M.E./M.S. in EE/CE or equivalent from a reputed university.
• 3–5 years in IC/module packaging design, packaging CAD, RF substrate layout, or a similar role.
• Strong software development proficiency in Python, including building tools and services that read from and write to databases.
• Experience developing web-based applications/platforms (front-end UIs plus back-end services and DB integration).
• Working knowledge of relational databases and data modeling (schema design, queries, integration across multiple data sources).
• Experience with source control and collaborative workflows in GitHub (branching, pull requests, code review; Gitflow or similar).
• Ability to translate domain/process knowledge and legacy spreadsheet/VBA logic into structured, maintainable software.
• Comfortable operating as a generalist—shifting between day-to-day support and long-term development as priorities evolve.
• Strong cross-functional communication skills; detail-oriented; thrives in a fast-paced, dynamic environment.

Desired Experience and Skills

• Experience modernizing VBA/Excel-based workflows into web platforms with automated triggers and validation.
• Familiarity with AI-assisted development tools (e.g., Claude, Cursor) and integrating them into a team workflow.
• Scripting/automation for IC or module packaging layout in SKILL, Python, or Tcl.
• Hands-on experience with Cadence Allegro Package Designer / APD or similar advanced packaging layout tools.
• Experience with packaging DRC/LVS or DFM rule development and verification.
• Understanding of back-end wafer flows and post-tapeout data (bump maps, mechanical/probe data, tapeout deliverables).
• Understanding of packaging technologies: laminate substrates, wirebond, flip-chip, WLP, and module-level integration.
• Knowledge of RF packaging fundamentals: controlled-impedance routing, via transitions, ground planes, and isolation structures.
• Experience packaging RF front-end modules (PAs, LNAs, filters, switches) for mobile or infrastructure applications; familiarity with BAW/SAW filter packaging and acoustic requirements.
• Exposure to EM-aware packaging practices and simulation of package interconnect (HFSS, EMX, or integrated APD EM flows).

#LIPR1