XPENG

SOC设计工程师(TOP集成)

XPENG  •  Onsite  •  2 months ago
Apply
AI can make mistakes so check important info. Chat history is never stored.

Job Description

SOC设计工程师(TOP集成)上海全职芯片板块职位描述1、参与自动驾驶芯片架构包括功能安全架构设计;
2、深度参与芯片外围套片方案和IO接口需求。
3、负责SOC顶层模块设计(顶层集成/电源管理/上电时序/IO选型/IO选型IOMUX管脚复用/可测性等);
4、负责 SoC 版本发布及交付,熟悉 SoC 设计/验证/中后端 的版本迭代,及 CICD 版本发布流程;
5、参与过大规模芯片 top 设计及 channel-less flow 者优先;
6、深度参与芯片后端floorplan评估选代,深度参与芯片面积优化;
7、深度参与芯片验证、后仿、底层软件开发联调以及芯片回片测试和量产导入等相关工作职位要求1、计算机体系架构,微电子,电子,通信或其他弱电相关专业背景,2年及以上SoC/IP设计,理解时序路径,电路分析能力强;
2、有完整的SoC设计开发流程及成功流片经验,尤其是有先进工艺下大型高算力芯片成功量产的经验;
3、具备极强的脚本能力,熟练使用 python/shell/tcl 等脚本工具,完成日常交付效率的提升;
4、熟悉AI, NOC, ARM, GPU, ISP, DSP, Computer Vision, Muilti-Media等IP接要求;
5、熟悉 magillem 集成工具使用者优先;
6、对时序、功耗、面积优化有很强的理解,有过ARM based的低功耗SoC设计和验证的经验;
7、熟练掌握Lint,CDC,Synthesis 等流程及其工具的使确 投递
XPENG

About XPENG

XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou,Guangdong province.

For more information, please visit https://heyxpeng.com.

Industry
Automotive & Mobility
Company Size
1,001-5,000 employees
Headquarters
Guangzhou, CN
Year Founded
2014
Social Media