SoC 设计工程师(MCU方向)
上海
全职
芯片板块
职位描述
工作职责: 1. 参与自动驾驶芯片架构包括硬件启动方案设计、功能安全架构设计; 2. 负责芯片SOC 内部 MCU微控制器子系统、低速接口、低功耗方案集成设计; 3. 熟练使用 Lint, CDC , RDC 等 RTLQA 工具检查设计质量； 4. 交付 TimingSpec 及时序约束, 深度参与芯片中后端迭代，深度参与系统或者模块级PPA优化; 5. 深度参与芯片验证、后仿、底层软件开发联调以及芯片回片测试和量产导入等相关工作。 任职要求: 1. 计算机体系架构，微电子，电子，通信或其他弱电相关专业背景 2. mcu 集成交付方向，做过 ARM M/R Core 系列处理器的集成交付； 3. 熟悉 CRG/IO/外设的交付，对总线，debug 有一定的理解，有过麦哲伦集成工具经验更佳； 4. 有过 VC_Spyglass lint/cdc/rdc flow 经验，且比较熟悉，参与过大芯片 hierarchy flow 者更佳； 5. 对 sdc约束，dft 结构，Timing report 有较好的理解，可以参与并拉通前中后端的交付事项； 6. 和 验证/FPGA/Emulator/软件 的交付支持工作，可以理解清楚验证下游对设计的需求以及相关改动； 7. 有过 2 个以上的完整项目的交付工作，有过 ISO26262 及 功能安全开发交付经验更佳；
职位要求
投递
XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou，Guangdong province.
For more information, please visit https://heyxpeng.com.
