Job Description

The people here at Apple don't just build products — they build the kind of wonder that's revolutionized entire industries. It's the diversity of those people and their ideas that encourages the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it.

We are looking for a self-driven, passionate Design for Manufacturability (DFM) Engineer. In this role, you will lead the development of manufacturing processes and stations (SMA, HotBar, etc.), ensure top-tier quality, and solve complex problems in creative, effective ways. You will also manage contract manufacturers (CMs) to support product development builds and high-volume mass production.

Preferred Qualifications

Master’s degree or above in Electrical Engineering (EE), Mechanical Engineering (ME), Manufacturing Engineering, Materials Science, etc.,
Additional technical expertise or PhD in automation, data science, or mechanical design is a strong plus.
Excellent communication and presentation skills, with a collaborative, team-player mindset suited for working across multiple functional groups.
Demonstrated leadership skills with the ability to act as a project leader on complex initiatives.
Strong quality mindset with experience navigating factory quality control systems (IQC, IPQC, SQE, QA/QE).
Proficiency with software and CAD tools for running DFM analyses (e.g., Siemens/Mentor Graphics Valor NPI).
A proactive, "can-do" attitude with the ability to perform well under pressure and tight deadlines.

Minimum Qualifications

A Bachelor’s or Master’s degree in Electrical Engineering (EE), Mechanical Engineering (ME), Manufacturing Engineering, Materials Science, or a closely related technical field, paired with relevant industry experience.
Experienced in Surface-Mount Technology (SMT) or related fields (e.g., packaging assembly).
General understanding of PCB fabrication, component packaging (general IC, SIP, discrete passive components), substrate materials, and surface finishes (OSP, ENIG, etc.), including how they impact solderability and reliability.
Familiar with process failure analysis (FA) as well as it’s equipment, tools, and methodologies.
Willingness to travel domestically and internationally.