Job Description

We are searching for a Silicon Photonics Packaging Co-op for our Fall 2026 Term to engage in the research and development of silicon photonics transceiver modules.

• Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
• Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
• Own Design Rules documents and ensure Design for Manufacturing specifications are met.
• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Drive package debug activities during product validation and qualification.
• Plan and Drive prototype assembly builds to enable deliveries for early design validation.
• Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
  

• Experience with package and process design/development from design to production.
• Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

• Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
• Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
• Experience in high-speed electronics package design and/or laser package design.
• Experience with thermo-mechanical simulations using ANSYS or similar software.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
• Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.