Job Description

At the forefront of Apple's innovation, the Data Collection Systems team designs cutting-edge solutions that integrate state-of-the-art sensing technologies across our products, including the iPhone, iPad, Apple Watch, MacBooks, Vision Pro, and beyond. Our team plays a key role in the advancement of ideas by creating hardware for systems that integrate novel technology for data collection and new feature development. Daily fresh challenges demand the sharp analytical skills of talented individuals. We have a collaborative, inclusive, and hands-on environment that cultivates engineering excellence, creativity, and innovation. You will contribute your own unique talents by working with engineers from teams across Apple to synthesize electrical, mechanical and software components.

Apple is meeting those needs as robustly and as creatively as possible and is interested
in people who want to help meet that commitment. The success we are striving will be
the result of very skilled people working in an environment which cultivates creativity,
partnership, and thinking of old problems in new ways. If that sounds like the kind of
environment that you find intriguing, then let's talk. These elements come together to
make Apple an amazing environment for motivated people to do the greatest work of
their lives. You will become part of a team that sets the standard in fostering excellence,
creativity and innovation. Will you help us design the next generation of revolutionary
Apple products?

In this role you will partner with cross-functional teams such as electrical, optical, embedded firmware, and software algorithm engineers to realize mechanical designs that integrate new technologies into systems for early-stage data collection. You will assist in setting technical requirements, design detailing, prototyping, fabrication, and the mechanical build process of low volume system manufacturing.

Preferred Qualifications

Exposure to real-world manufacturing and quality control processes including IQC, IPQC, tolerance analysis, DFM/DFA, and GD&T.
Experience with Siemens NX and and familiarity with design, fabrication and assembly of flexible or rigid printed circuit boards
Hands-on experience integrating electronics, sensors or cameras within tight packaging or thermal constraints
Understanding of optical and imaging systems, force, touch, or inertial sensing technologies
Strong written and verbal communication skills with the ability to interact with management, team members and external vendors
MS in mechanical engineering with proven industry or internship experience

Minimum Qualifications

Strong mechanical engineering fundamentals with good analytical skills and familiarity selecting materials and manufacturing processes based on engineering requirements
Proficiency in 3D CAD modeling and generating 2D manufacturing drawings
Minimum requirement of a bachelors degree