Responsibilities：

• Lead system engineering activities for new product introduction (NPI), including SoC definition, hardware system design, PISI, bring-up, debugging, validation, technical documentation, reference schematic/layout design, and application note preparation.

• Own and drive cost effective reference platform design.

• Provide customer support and technical enablement, including training, demo/prototype bring-up, onsite troubleshooting, technical presentationsand workshops.

• Manage and deliver multiple NPI and customer projects in parallel under aggressive schedules.

Requirements：

• Bachelor’s degree in electrical engineering with 7+yearshardware board design experience.

• Independent experience in system board designwithCortex-A5x/A7x.

• Independent design experience with PMIC、DC-DC、LDO power systems.

• Strong PCB layout expertise including material selection, dielectric/stackup, SI/PI principles, and HDI high speed layout.

• Hands on experience with signal integrity (SI) and power integrity (PI) analysis.

• Familiarity with PCBA manufacturing processes including DFM, EMI/ESD, thermal design, and testing.

• Proficient inhigh-speedinterface design and validation: DDR, LPDDR4, LPDDR5/5x, eMMC, QSPI, PCIe4.0, USB3.0 (with/without PD), Ethernet, etc.

• Skilled at Cadence OrCAD / Allegro.

• Experience with EMI/EMC compliance is a plus.

• Understanding SI theory; familiarity with CadenceSigrity,HyperLynxor similar simulation tools is a plus.

• Familiar with diagnostic tools such as logic analyzers, oscilloscopes, protocol analyzers, etc.

• Strong communication skills in both English and Chinese.

• Demonstrated ability to drive technical issues to close.

• Detail oriented, patient, responsible, with strong initiative and willingness to learn.

• Capable of working under very tight project schedules.

• Strong teamwork and independent work capability.

• Excellent presentation skills.

• Experience in embedded software is preferred.

• Familiarwith Microsoft Office, Visio, PowerPoint.