Job Description

As a Senior Staff / Principal Product Engineer at indie Semiconductor, you will be a key member of the Product Engineering team responsible for bringing Radar Transceiver, Digital SoC, and Power ASIC-based products through the full product lifecycle, from development to production release.

In this role, you will develop production test plans to verify product performance and perform statistical analysis using sound methodologies to establish test limits and datasheet specifications.

You will collaborate closely with Design Engineering, DFT Engineering, Test Engineering, Quality and Reliability, Applications Engineering, and Marketing to analyze and resolve issues related to product samples, pre-production, and full production release. You will also work with internal teams and offshore assembly and test facilities to successfully transition products into manufacturing.

Success in this role requires a strong background in semiconductor product manufacturing processes, excellent analytical skills, and the ability to collaborate effectively across multiple engineering disciplines and global locations.

Key Responsibilities

• Work with Design and ATE Engineers to understand and document specification compliance requirements, test flows, test plans, test correlations, and full test coverage.
• Collaborate with Product Reliability and Package Qualification teams to define qualification test plans, establish detailed schedules, and complete AEC-Q100 qualifications and PPAP activities on schedule.
• Drive creative solutions to improve product cost margins through assembly yield, test yield, test time reduction, and scrap cost optimization while applying Automotive Zero-Defect Strategy methodologies throughout product design, manufacturing, and sustaining phases.
• Define and resolve product issues using the 8D problem-solving methodology, including identifying failure modes, affected material quantities, fallout percentages, and overall business impacts.
• Perform Process/Voltage/Temperature (PVT) corner characterization and calculate associated product datasheet limits.
• Ensure all aspects of New Product Introduction (NPI) and production manufacturing are established and documented, including hardware, BOMs, costing, MSA/Gage R&R, assembly and packaging records, CP and FT test solution releases, backend record releases, and safe launch planning and execution.
• Coordinate closely with foundries, planning, program management, assembly and packaging engineering, test engineering, and OSAT assembly and test vendors from tape-out through wafer-out and into production, ensuring prototype package and ATE test solution transfers meet aggressive schedules.
• Provide real-time customer support for design-, product-, and quality-related concerns.
• Continuously monitor assembly and test yields, identify opportunities for improvement, establish non-conforming criteria, and ensure timely disposition of production materials on hold by both indie and OSAT partners.

Desired Background and Experience

• Bachelor's degree in Electrical Engineering or an equivalent engineering discipline.
• 5+ years of experience as a Product Engineer within the semiconductor industry.
• Experience with ATE and bench characterization of semiconductor devices, including TX, RX, and LO.
• Working knowledge of ATE hardware engineering and test engineering support, including hardware and software setup, handler and tester troubleshooting, and rapid data analysis, diagnosis, and assessment.
• Demonstrated ability to analyze data using sound statistical methodologies and effectively communicate technical information.
• Proficiency with data analysis and statistical tools such as Excel, JMP, and YieldHub.
• Strong background in product reliability and qualification standards, including JEDEC and AEC-Q100 specifications.
• Exceptional communication and collaboration skills with experience working across cross-functional teams and external partners, including foundries, assembly and test houses, and reliability and qualification vendors.