Job Description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Staff Engineer Unit Process Engineering, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role

Key responsibilities in your new role

In this role, you will serve as the technical expert for molding processes, making critical product quality decisions, leading complex defect investigations, and driving effective root-cause resolution. You will optimize molding processes, ensure robust tooling design, and mentor engineering teams to enhance technical expertise and manufacturing excellence.

• Serve as the final technical expert to make "go/no-go" decisions on product quality when molding issues or excursions happen
• Lead root-cause analysis for complex molding defects and demonstrate a strong understanding of fluid dynamics to resolve localized wire sweep, S-curve deformations, mold void, etc.
• Optimize transfer molding parameters including transfer speed, injection pressure, and cure profiles to protect high-density wire profile
• Review, approve and ensure proper gate placement, runner balance, and venting before tooling fabrication
• Guide and mentor engineers to improve team's overall technical problem-solving capabilities

Your profile

Qualifications and skills to help you succeed

You strive for excellence in semiconductor packaging and transfer molding, leveraging strong expertise in moldability concepts to prevent defects, optimize process performance, and ensure product quality. You are a confident communicator with hands-on industry experience, capable of providing data-driven recommendations and risk assessments to support technical and business decisions.

• Bachelor's Degree in engineering discipline (Electrical, Mechanical, Electronic, Materials Engineering, and other semiconductor-related areas)
• Minimum 5 years of working experience in a semiconductor environment or any related field
• Hands-on experience in semiconductor packaging, special focus on transfer molding (MapMold and Cavity)
• Highly proficient in moldability concept to predict and prevent overall molding defects
• Strong communication skills with the confidence to deliver clear, data backed recommendations and risk assessments directly to management

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.