Job Description

The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics.

At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day.

Show the world what you are made of.

Your new responsibilities

• In charge of the elevant front end wafer fabrication process in Dry Etch / PECVD / ALD fields.
• Full process ownership on quality, yield, damage containment, process capability and stability, cost, CpK and other related KPIs.
• Lead process transfer ramp qualification projects, cooperate with cross-functional teams (Production, Process Integration, Process Development, Industrial Engineering, Production Planning, Quality Management, EHS, Facility Infrastructure & Hook-up, IT/CIM, Procurement, SCM, Project Management, Regensburg counterparts).
• Create and maintain documentation (process/maintenance/operation/tool procurement/safety specification and procedures; FMEA; Control Plans; 8D lesson learnt etc)
• Setup and maintain manufacturing/quality tools (SPC; FDC; SAP PM Scheduling; CIM/EI)
• Provide training to junior engineers, technicians, manufacturing specialists.
• Lead/participate in cross-functional projects (cost/yield/capacity/safety/productivity continuous improvement projects)

Who we are looking for

• Candidate must have at least a Bachelor's Degree in Engineering or Science. Candidate with Master's Degree or PhD will have an added advantage.
• 10 years of front-end semiconductor wafer fab working experience & competency in manufacturing, process engineering, product or process development
• Experienced in leading cross-functional teams (process & equipment engineering, production)
• Ability to work effectively in cross-cultural multi-national working environment & organization.
• Experience with SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI and Digital Manufacturing & Automation.
• Fluent in English and Bahasa Malaysia.

Please contact Muhammad Hafizuddin Mohamed Anuar for further information via Hafizuddin.Anuar@ams-osram.com or +60 (4) 3053141.