Job Description

Join our Package Technology Development team and play a key role in driving the development, integration, and qualification of advanced semiconductor package technologies. As a Senior Staff Engineer, you will lead technology risk assessments, package integration activities, and cross-functional collaboration efforts to ensure robust package development and successful industrialization of new semiconductor products.

Your role

Key responsibilities in your new role

• Drive Package Business Case (PBC) and Technology Project Case (TPC) assessments, ensuring technical feasibility, manufacturability, and technology readiness for new package developments.
• Lead Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities and drive proactive risk identification, assessment, and mitigation strategies throughout the development lifecycle.
• Own risk interaction assessments and mitigation work packages related to package technologies, materials, process integration, and manufacturing readiness.
• Drive the integration of unit processes, Bills of Materials (BOM), and process flows within package platforms, including assessment of inter-process interactions and technology compatibility.
• Act as the key technical partner for Front-End (FE) and Back-End (BE) interaction topics, ensuring successful technology integration across development and manufacturing environments.
• Support pre-development activities for next-generation chip and package technologies through feasibility studies, risk assessments, and technology evaluations.
• Lead or participate in 8D investigations, root cause analysis activities, and technical problem-solving task forces related to package interaction and integration challenges.
• Evaluate the impact of package design rules on process interactions, manufacturability, quality, and reliability performance.
• Provide technical guidance, consultation, and mentoring to project teams and stakeholders on package technology development and integration topics.
• Collaborate with global cross-functional teams to ensure successful project execution, technology qualification, and product release.

Your profile

Qualifications and skills to help you succeed

• Minimum Bachelor's Degree in Semiconductor Technology, Microelectronics, Automation Engineering, Mechanical Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related engineering discipline.
• Minimum 7 years of relevant experience within the IC or semiconductor industry, preferably in Package Development, Process Integration, Technology Development, Assembly, or Manufacturing Engineering.
• Strong knowledge of semiconductor packaging technologies, assembly processes, process integration, and package development methodologies.
• Experience conducting technical risk assessments, DFMEA activities, process interaction studies, and technology qualification projects.
• Strong analytical, troubleshooting, and problem-solving capabilities with the ability to resolve complex technology integration challenges.
• Excellent communication and stakeholder management skills with the ability to work effectively across global, cross-functional, and cross-site teams.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

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We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

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