Job Description

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks?

As a Senior Staff Engineer Package Technology in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role

Key responsibilities in your new role

• Serve as the technical expert for lead frame, substrate, and packing material development projects.
• Design, prepare drawings, and define specifications for lead frames and substrates based on design guidelines and assembly rules, ensuring manufacturability, quality, and cost effectiveness.
• Collaborate with internal teams and material suppliers on packing material design, specification, and selection while ensuring manufacturability, quality, and cost effectiveness.
• Drive lead frame, substrate, and packing material development activities to achieve project milestones, cost targets, and documentation release requirements (specifications, drawings, GIMM, etc.).
• Liaise with SQM and suppliers to ensure fulfillment of quality requirements, FAI completion, and qualification release for lead frames, substrates, and packing materials.
• Establish design guidelines and requirements for lead frame, substrate, and packing material specifications.
• Generate technical papers, journals, and patents related to lead frame, substrate, and package design to enhance technical value.
• Support incoming material quality activities and work with suppliers and internal teams to resolve technology and quality issues, and drive improvement programs.
• Participate in lead frame and packing material technology roadmapping, UPEG activities, and material selection to meet roadmap requirements.

Your profile

Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics).
• Minimum 7 years of experience in semiconductor assembly and packaging development, with relevant experience in lead frame and packing material preferred.
• Knowledge of lead frame/substrate design and packing material development and qualification.
• Knowledge of material physics and properties related to lead frames, substrates, and packing materials.
• Knowledge of GD&T and material specification definition.
• Strong analytical and problem-solving skills.
• Basic knowledge of semiconductor packaging, assembly, and test processes.
• Knowledge of material development, analysis, qualification, and reliability.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.