Job Description

Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful BU ME TDI-ICS Team in China in Chongqing, we are looking for a passionate

Senior Specialist I TDI Etching/AOI CHQ 1/3

Your Responsibilities

• Support and execute Client and Server certification milestones activities. This includes Yield, IPP/KPP and Ctf improvements to exceed customer expectation
• Participate in cost saving activities to meet plant level goal
• Optimize current processes in collaboration with customer that will enhance process efficiency, run rate while maintain cost and establish a stable process.
• Support Path Finding Activities including collaboration with customer and internal teams as well as process integration across multiple functional departments
• Understand wellness of the process, product and equipment in real time. Identify any shifts from baseline and react accordingly. Real time correction of any shift and no OOC/OOS.
• Material change, chemistry change, BCP, process change, etc.
• Development of Qualification plans, DoE plans and procedures, Evaluation procedures for CIP (IPP, KPP, CtF and Yield). This extends until HVM handover and ramp up. Certification timely.
• Maintain Yield baseline and improve Yield Performance, Yield monitoring and Low Yield Analysis as well as IPP (Cpk >1.33)
• Perform internal role-specific Line Audits and identify any risk activity that can affect safety, product, and process or equipment stability. Capture all risk items timely.
• Recipe development, recipe maintenance and recipe management within the department with HVM
• Identify the tool capability gaps and close the gaps to mitigate product output deviations
• Work / Participate on Projects (Cost cutting, Green Belt, Yield improvement, Taskforces etc.)
• Write Tool Specification for new Equipment, Qualify, and handover for HVM
• Write Material Specification for new Material and maintain Specification for existing material
• Communicate with customer through regular meetings, participate or lead and close internal and external WG or TF
• Develop and support path finding activities based on new materials and processes in collaboration with customer and internal teams

Your Profile

• Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry
• Degree from university or higher technical college
• Basic knowledge of quality standards (ISO /IATF16949)
• Familiar with quality tools like SPC, MSA, FMEA, PPAP, APQP
• Good analytical skills with attention to details and Good stress management skills
• Fluent written and oral English (Mandarin would be of advantage)
• Open minded approach and willing to overcome new challenges
• Good team working spirit
• Good communication and negotiation skills
• Computer skills - MS Office Package ( Word , Excel , PowerPoint etc )

Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. Our compensation packages are competitive and take individual qualifications and experience into consideration.