Job Description

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

Senior SI/PI Engineer either based in Hyderabad, Bangalore or Taiwan.

We are looking for a Senior SI/PI Engineer with strong hands-on experience in signal integrity and power integrity for semiconductor, package, PCB, and high-speed interconnect applications. The ideal candidate will have deep expertise in electromagnetics, system-level design, material interactions across package, PCB, connector, and cable domains, and the ability to solve complex high-speed design challenges in real-world systems.

Key Responsibilities

• Perform and lead theoretical and simulation-based SI analysis of PCB products, channels, test structures, and system implementations.
• Drive Signal and power delivery solutions for PCB and Package and evaluation platforms in collaboration with design teams.
• Work closely with circuit designers to ensure robust SI/PI implementation in silicon.
• Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges.
• Engage with customers and suppliers to define and validate hardware solutions including packages, PCB/backplane layouts, materials, interposers, and connectors.
• Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders.
• Evaluate and benchmark signaling schemes such as Chord signaling and PAM in terms of SI/PI performance, power, and implementation trade-offs.

Required Experience

• 12+ years of experience in the semiconductor industry, with a focus on signal and power integrity.
• Strong foundation in electromagnetics and system-level design, including material behavior across package, PCB, board, connector, and cable, as well as analog, power, and digital electronics.
• Proven experience solving significant SI problems through innovative connector, package, or cable design.
• Hands-on problem-solving ability with the capability to quickly grasp new concepts and translate them into practical solutions.
• Strong cross-functional communication skills and a collaborative working style.
• Experience with high-speed interfaces including DDR5 and PCIe.
• Experience with Cadence board layout environments and SI/PI tools.

Technical Skills

• Deep understanding of SI/PI design and simulation across abstraction levels, from EM modeling to system-level link behavior.
• Expertise with EM/SI/PI tools and modeling flows, including calibration, correlation, and validation.
• Familiarity with lab measurements using VNA, spectrum analyzers, and high-speed oscilloscopes.
• Strong intuition for EM simulation trade-offs, including accuracy, runtime, model complexity, and design impact.
• Experience with channel modeling and extraction for multi-Gbps systems, including end-to-end link considerations.
• Proficiency in Linux-based design environments and scripting for modeling and automation.
• Solid understanding of signaling schemes and link architectures, including performance, complexity, and power trade-offs.

Preferred Qualifications

• Experience with DDR5 interface analysis, routing considerations, and channel optimization.
• Experience with PCIe channel design, equalization, and validation.
• Hands-on experience with Cadence Allegro, Sigrity, Clarity 3D, and related toolset.
• Exposure to advanced PCB Layout techniques for large server-based systems
• Strong documentation and presentation skills for technical reviews and customer communication.

Education

• Required: Master’s degree in Physics, Electronics, Electrical Engineering, or equivalent.
• Desired: PhD in electromagnetics-related areas such as Physics, Electrical Engineering, or Electronics Engineering.

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

www.kandou.ai