Job Description

You are a leader and curious about technical solutions?

You like to shape technologies addressing future trends in volume production of advanced packaging platforms in the semiconductor industry?

You are keen to drive development of next generation power modules, PCB embedding and vertical integration?

As Senior Project Manager OSAT you are able to bring challenges into reality and establish mature technological solutions for Packaging at right time, cost and quality.

Your role

Key responsibilities in your new role

• Be responsible for package/process development projects in close collaboration with all Infineon Business Units and global subcon partners, ensuring robust technical maturity and seamless transition into serial production.
• Focus will be on PCB Embedding and Panel Level Packaging for next generation Power Modules.
• Lead package innovation Projects starting from package/technology definition towards high volume integration.
• Be responsible for enabling and releasing new Subcons, package/technology platforms, as well as subsequent derivatives.
• Be responsible for change management projects, handling major changes to package, process or subcon
• Lead international and multidisciplinary Teams (Europe, US, Asia)
• Support package platform assessments between subcons, as well as second source introduction
• Support Subcon/Technology roadmap alignment

Your profile

Qualifications and skills to help you succeed

You have a high level of self-motivation and are used to work independently to drive technical projects. Even in complex situations, you remain aware of the big picture and make decisions despite uncertain circumstances. As a team player, you set the direction in your area of expertise and cooperate across boundaries. You recognize and use the different areas of expertise and skills of the team members.

• A Master degree in Mechanical/Electrical/Material Science/ Physics disciplines or related qualifications. PhD is a plus
• Minimum 7 years of experience in semiconductor technology or manufacturing and assembly
• At least 5 years of experience in leading complex development projects. IPMA-C certification or equivalent is a plus.
• A strong technical background and experience with advanced packaging technologies and assembly processes
• Knowledge in PCB manufacturing, Chip Embedding, Power Module packaging and assembly including related manufacturing processes is a plus.
• Experience of working with or within semiconductor subcontractors
• Good understanding of quality requirements of semiconductor products, as well as packages
• The ability to work in and lead cross-functional and global teams in a multicultural environment
• Strong communication skills in English and Chinese, German is a plus

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.