Job Description

Senior Process Engineer - Semiconductor Assembly &
Packaging

Location: Bangkok

Employment Type: Permanent

Experience: 5-7 years

Salary: Open, depending on experience

Relocation: Expatriate candidates welcome, with
relocation support

About the Role

Our client, a
leading global semiconductor assembly and testing company, is seeking a Senior
Process Engineer to lead technical projects across semiconductor assembly and
advanced packaging processes.

The position will
focus on improving manufacturing yield, quality, equipment efficiency and cost.
Relevant technologies include Power QFN, Cu Clip, SiP, die attach, flip chip,
wire bonding and molding.

The successful
candidate will combine strong hands-on process knowledge with project
leadership, customer communication and the ability to mentor junior engineers.

Responsibilities

• Lead engineering projects
  focused on yield improvement, equipment efficiency, quality and cost
  reduction.
• Maintain and improve
  semiconductor assembly and packaging processes.
• Support technologies
  including Power QFN, Cu Clip, SiP, die attach, flip chip, wire bonding and
  molding.
• Troubleshoot process
  abnormalities, equipment issues and product defects.
• Conduct root-cause analysis
  and implement corrective and preventive actions.
• Apply DOE, SPC, FMEA, 8D and
  other process-control methodologies.
• Optimize equipment settings,
  process parameters, materials and production methods.
• Support new product
  introduction, process qualification, engineering builds and
  mass-production ramp-up.
• Monitor process capability,
  yield, quality, productivity and cycle time.
• Lead technical investigations
  into customer complaints and production issues.
• Act as a technical interface
  with customers and present engineering solutions.
• Mentor junior engineers and
  provide technical guidance during project execution.
• Coordinate with Production,
  Equipment, Quality, Product Engineering, R&D and customer teams.
• Prepare process
  specifications, control plans, work instructions and engineering reports.
• Implement engineering best
  practices and manufacturing standards.

Requirements

• Bachelor's or Master's degree
  in Electronics, Electrical, Mechanical, Materials, Mechatronics,
  Industrial Engineering or a related field.
• Approximately 5-7 years of
  experience in semiconductor assembly, advanced packaging or OSAT
  manufacturing.
• Strong hands-on experience in
  one or more of the following:
• Power QFN or Cu Clip
• PMOS or MOSFET packaging
• SiP or System-in-Package
• Flip chip
• Wire bonding
• Molding
• Direct Cu Clip or Power QFN
  experience would be highly advantageous.
• Strong process
  troubleshooting, defect analysis and root-cause analysis skills.
• Demonstrated experience
  improving yield, quality, productivity or manufacturing cost.
• Working knowledge of DOE,
  SPC, FMEA, 8D and process-control methodologies.
• Six Sigma Green Belt
  certification is preferred.
• Able to lead engineering
  projects and mentor junior engineers.
• Strong customer communication
  and technical presentation skills.
• Working English is required
  for expatriate candidates.
• Open to candidates requiring
  relocation to Thailand.