Job Description

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing. This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements. The engineer acts as a technical subject matter expert, providing hands‑on support to operators and technicians while collaborating cross‑functionally with Design, Quality, Manufacturing Engineering, and Supply Chain.

Must be US Citizen or PERM Resident

Key Responsibilities

Process Development & Optimization

• Develop, refine, and sustain automated wire bonding processes (ball bonding, wedge bonding, ribbon bonding, and related technologies).
• Establish and optimize bonding parameters, material selections, and tooling configurations for new and existing products.
• Lead DOE (Design of Experiments) and statistical analysis to improve yield, reduce variation, and enhance process robustness.
• Define process controls, monitor KPIs, and ensure compliance with industry standards (e.g., MIL‑STD‑883, IPC‑A‑610, J-STD‑001).

Production Support

• Provide daily engineering support to manufacturing related to wire bond equipment, tooling, and process troubleshooting.
• Partner with operations and technicians to resolve production issues, material defects, and equipment performance problems.
• Implement root cause and corrective actions (RCCA), including 5‑Why, fishbone analysis, and FMEA updates.
• Support production ramp, maintaining stable throughput while minimizing scrap and rework.

Equipment & Tooling

• Serve as equipment owner for automated wire bonders (e.g., Palomar, Hesse, Kulicke & Soffa, or equivalent).
• Develop and maintain PM procedures, calibration requirements, and equipment qualification documentation.
• Identify and implement upgrades, automation improvements, and fixturing enhancements to improve reliability and operator safety.

Documentation & Compliance

• Create and maintain technical documentation: work instructions, process specifications, PFMEA, control plans, and training materials.
• Ensure compliant handling of sensitive information and adherence to company, customer, and government requirements.
• Support internal and external audits through documentation, data, and process demonstrations.

Continuous Improvement

• Lead yield improvement projects and cycle‑time reduction initiatives.
• Drive process automation and digitalization efforts aligned with factory modernization goals.
• Support lean manufacturing activities including 5S, standard work development, and waste reduction.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Manufacturing Engineering, or related field preferred.
• 3+ years of relevant experience in microelectronics manufacturing, preferably with automated wire bonding.
• Strong hands-on experience with automated wire bonders and related process inputs (ultrasonic energy, force, time, loop profiles, etc.).
• Proficiency with SPC, DOE, statistical analysis, and data‑driven decision making.
• Demonstrated ability to troubleshoot both equipment and process-level issues.
• Ability to read technical drawings, schematics, and material specifications.

Preferred Qualifications

• Experience in an aerospace, defense, semiconductor, or high-reliability manufacturing environment.
• Familiarity with MIL‑STD‑883, NASA workmanship standards, and high-reliability bonding requirements.
• Knowledge of epoxy attach, die bonding, hermetic packaging, or related microelectronic assembly processes.
• Experience with MES systems and digital process documentation tools.
• Strong communication skills with the ability to train operators and lead cross-functional projects.

Core Competencies

• Technical Problem Solving
• Process Ownership & Accountability
• Attention to Detail and Quality Focus
• Cross-functional Collaboration
• Continuous Improvement Mindset
• Strong Documentation and Communication Skills

Salary Range:

$113,600.00-$151,400.000

Pay Transparency

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​