Job Description

Job Title: Senior
Power Module Process Engineer

Our client is
seeking an experienced Senior Power Module Process Engineer to support the
development and manufacturing of advanced semiconductor power-module products.
The successful candidate will lead process characterization, establish critical
manufacturing controls, and collaborate with cross-functional engineering teams
to improve product quality, reliability, cost, and production performance.

Key Responsibilities

• Conduct Design of Experiments
  (DOE) and process characterization for critical power-module manufacturing
  processes.
• Define process materials,
  operating parameters, tooling controls, and handling procedures.
• Develop and maintain
  process-design guidelines, control plans, and manufacturing
  specifications.
• Work closely with Process
  Engineering, Equipment Engineering, Quality, Product Management, and other
  technical teams.
• Troubleshoot complex
  manufacturing and product-quality issues.
• Analyse engineering and
  production data using statistical methods.
• Support process optimization,
  yield improvement, reliability improvement, and defect-reduction
  initiatives.
• Participate in cost-reduction
  projects related to power-module products.
• Prepare technical reports and
  communicate findings to internal stakeholders.

Qualifications and
Experience

• Bachelor's degree or higher
  in Electronics, Electrical Engineering, Mechanical Engineering, Materials
  Engineering, Chemical Engineering, Industrial Engineering, or a related
  field.
• At least five years of
  relevant experience in semiconductor assembly, power modules, wafer-level
  packaging, IC packaging, or electronic-module manufacturing.
• Practical experience in
  product or process development, material selection, assembly, or package
  reliability.
• Strong knowledge of
  engineering data analysis, SPC, DOE, APQP, and FMEA.
• Candidates must have detailed
  practical knowledge of at least two or three of the following processes:
• Advanced SMT, including
  high-density, multilayer, or double-sided component assembly.
• Silver or copper sintering,
  including pressure and pressureless sintering.
• Soft-solder die attach.
• Aluminium or
  aluminium-copper wedge and ribbon bonding.
• Vacuum or formic-acid
  reflow.
• Advanced flip-chip
  processes, including multi-die, stacked-die, fine-pitch flip chip, and
  thermo-compression bonding.
• Capillary underfill for
  fine-pitch flip-chip or thermo-compression bonding applications.
• Advanced copper-clip
  processes, including exposed copper clips.
• Heat-sink or heat-slug
  attachment.
• Advanced moulding, including
  double-sided moulding, low-wire-sweep moulding, liquid moulding, and
  compression moulding.
• Low-stress blade or
  laser-singulation processes.

Key Copetencies

• Strong analytical and
  structured problem-solving skills.
• High level of responsibility
  and attention to detail.
• Quality-focused mindset with
  a strong commitment to zero-defect manufacturing.
• Effective cross-functional
  communication and coordination skills.
• Good command of English.