Are you passionate about pushing the boundaries of photonic integrated circuit (PIC) technology? Lightium, a leading-edge photonics startup, is looking for a skilled PIC Process R&D Engineer to spearhead the development of new processes and modules for our innovative thin-film lithium niobate (TFLN) platform. This role offers a unique opportunity to contribute to the next generation of photonics solutions while collaborating with top academic institutions.
As a Photonics PIC Process R&D Engineer, you will develop and optimize new process modules to advance our TFLN-based PIC platforms. Your contributions will be pivotal in continuing the innovation at the process level in state-of-the-art cleanroom, bringing our cutting-edge photonic technologies from concept to mass production.
Process Development: Define, develop and implement innovative process modules for TFLN-based PICs in collaboration with state-of-the-art R&D and production cleanrooms.
Experimental Work:
Conduct experiments and process trials in cleanroom environments, analyzing data to optimize and validate new processes.
Collaboration:
Work closely with the R&D teams from design to optical testing and characterization, contributing to cross-functional projects to advance our PIC technologies.
Documentation and Reporting: Maintain thorough documentation of process development and report findings, as well as implement process optimization methods such as Design of Experiment (DoE).
Process Integration: Assist in integrating new processes into our production workflows, ensuring they meet the highest quality and reliability standards.
Innovation:
Stay up-to-date on the latest advancements in photonics, incorporating new techniques and technologies into our process development.
Educational Background: An advanced degree (PhD or Postdoc) in Photonics, Electrical Engineering, Physics, Materials Science, or a related field.
Experience: Prior work experience in process design and cleanroom process development at industrial level in thin-film lithium niobate or lithium tantalate technology. Prior experience with other photonics platforms, such as silicon photonics, SiN, InP or related photonics platforms are a plus.
Technical Skills: Excellent proficiency in microfabrication techniques such as plasma etching (ICP, RIE, IBE, etc.), e-beam lithography, UV/DUV stepper lithography, contact mask lithography, wet etching, thin-film deposition (CVD, LPCVD, PECVD, ALD, sputtering, etc.), metallization. Strong background in metrology and thin-film characterization is a plus.
Organization & Documentation:
Strong organizational skills to plan your work schedule between multiple facilities, record your results and processes, follow facilities’ guidelines, and use best practices to maintain confidentiality.
Collaboration:
Excellent communication skills and the ability to work effectively in a multidisciplinary team.
Adaptability:
The ability to thrive in a fast-paced startup environment, demonstrating flexibility and resilience in the face of change.
Language Skills: Fluency in English is required; knowledge of German or French is an advantage.
A unique opportunity to lead a cutting-edge manufacturing initiative in the rapidly growing field of photonics.
A collaborative and innovative work environment where your contributions will shape the future of telecommunications, datacom, and beyond.
A competitive compensation and benefits package, including employee stock option plan (ESOP) that reflects your experience and expertise.
To become a key player in an early-phase startup and join a young, motivated, and energetic team. You will have the unique opportunity to create, grow, and develop your professional skills at a fast pace.
We'd love to hear from you if you're passionate about building new tech from the ground up and thrive in a collaborative and result-driven environment. Lightium is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
We are a Swiss startup powering ultra-fast, energy-efficient photonic devices through the first 200 mm foundry platform based on thin-film lithium niobate (TFLN).
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