Job Description

Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

• Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
• Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, etc…
• Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
• Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

You have:

• 5-8 years of experience in high-speed electronics and Silicon Photonics package design.
• Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, die attach.
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Experience in high-volume packaging of optical transceivers, co-packaged optics, multi-chips module, pluggables, 2.5/ 3D packages.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
  

It would be nice if you also have:

• Familiar with optical coupling, fiber pigtail and free space optics.
• Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six-Sigma process and analysis).
• Familiar with Industry Test Standard, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
• Knowledge of material properties and associated mechanical part fabrication processes.

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Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia