Job Description

Shape the Future of Semiconductor Innovation at Intel Foundry

Organization Overview

Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry TechnologyManufacturing andis focused on accelerating technologyrampand manufacturing excellence. Our mission is to seamlessly transitioncutting-edgetechnologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.

MDCE is seeking aSeniorMetals Deposition Engineertodrive world-class process performance and manufacturability for advancedmetalsdeposition modules across Intel'scutting-edgetechnology nodes (18A, Intel 3, and 12nm). This strategic role bridges Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, ensuring seamless module readiness from early development through full production ramp and ongoing support.

Key Responsibilities

Strategic Leadership & Execution

• Align organizationalobjectiveswith technical vision and formulate strategies forcutting-edgesolution delivery
• Execute customer-first initiatives with relentless focus on meeting deadlines and requirements
• Synthesize diverse inputs to develop strategic responses and drive rapid execution of challenging schedules

Technical Problem Solving & Collaboration

• Own resolution of complex technical challenges, integrating solutions across multiple organizational groups (including technology development andhigh volumemanufacturing)
• Collaborate effectively with Technology Development (TD), manufacturing (TFSM), and Business Groups to achieve common goals
• Engage internal and external stakeholders including Integration, Device, Yield, Defect Metrology, Quality, Reliability teams, and suppliers

Team Leadership & Industry Expertise

• Define team goals, remove obstacles, and ensuretimelydelivery of process solutions
• Stay current with industry-leading technologies and direction-setting trends
• Foster in-person collaboration to accelerate decision-making and problem resolution
• Take ownership of outcomes and proactively surface and resolve issues

Soft Skills

• Mentoring experience and ability to serve as technical focal point
• Strong ownership mindset with end-to-end problem-solving capabilities
• Ability to thrive in fast-paced, ambiguous environments whilemaintainingsafety, quality, and compliance standards

Qualifications:

The Minimum qualifications arerequiredto be initially considered for this positionMinimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to theminimumrequirements and are considered a plus factor inidentifyingtop candidates.

MinimumQualifications

• Master's degree  in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field
• 7+ years of semiconductor manufacturing, process development, or technology development experience
• 4+ years of direct experience with metals deposition modules
• Hands onExperiencewith one or more deposition technologies:(PVD, CVD, and/or ALD technologies for metals, conductive films, or barrier/liner stacks)
• Experience in process development, optimization, and HVM transfer
• Previous semiconductor foundry experience

Preferred Qualifications

• Doctoral degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field
• Previoussemiconductor foundry experience preferred
• Experience with advanced technology nodes (10nm and below), particularly Intel 18A, Intel 3, Intel 4/7, or comparable foundry nodes
• Experience with metals deposition modules including:(Contact/MOL metals (W, Co, Ru, liners/barriers,BEOL/Cu interconnect (Cu/Co/Ru/W, caps, barriers, seed,Advanced liners/barriers/adhesionlayersor conductive films)
• Technology ramp and transfer experience from TD to HVM
• Supplier collaboration experience for hardware, chamber design, or chemistry improvements
• Cross-functional leadership experience with task forces for yield improvement and technology ramp
• Experience in integration and module interactions (e.g.deposition with CMP, lithography, etch, clean)

Why Join Intel MDCE?

Intel offers an exceptional opportunity to work withcutting-edgetechnology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs andmaintainleadership in high-volume manufacturing.

Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.