Tasks:
PCB design based on specification and complementary information according to the project manager and development manager
Collaboration with the project leader and group leader on development time estimations for the new projects
Definition of PCB geometry (outline, mounting holes)
Creating library elements (PCB footprint)
Components placement (layout of PCB components)
Provision of information for mechanical construction (girders, panels, height restrictions)
Cooperation with the design of cooling solutions
Define PCB design/ routing strategy and setting geometrical-electrical constraints
High speed and multi-layer embedded PCB layout according to the design rules, and meets the DFM requirement
Tuning the signal quality to meet signal integrity requirement
Simulate layout work using signal integrity and power integrity tools
Generate output data and production documentation
Requirements:
Bachelor's Degree in Electronic Engineering or equivalent.
Experience in high speed multi-layer PCB layout and defining PCB layout design rules.
Familiar with DFM (Design for manufacturing) and DFT (Design for Testing) requirements.
Experience in motherboard/ module layout will be an advantage.
Experience in power integrity and signal integrity simulation will be an advantage.
Familiar with standards-based design such as PCIe, USB, DP will be an advantage.
Familiar with Cadence Allegro will be an advantage.
Positive attitude & good team player.

congatec is a leading global provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COMs). These advanced computer modules drive systems and devices across industries such as industrial automation, medical technology, robotics, telecommunications, and more.