Job Description
Location(s)
Zhuhai, Guangdong
Company
Molex
Career Field
Engineering
Job Number
190445
DUTIES & RESPONSIBILITIES:
- Design structural solutions for passive all-optical connectivity products (optical engine, silicon photonic interconnect module, OIO/CPO packaging), including optical device packaging selection, coupling structure design, thermal structure design, and custom fixture development, to guarantee optical alignment accuracy and long-term reliability after packaging.
- Collaborate with upstream optical component and substrate (glass/PCB) design teams to define packaging specifications, and promote full-cycle implementation of packaging solutions from R&D prototype verification to NPI mass production.
- Lead the development and optimization of structural requirements for COB, flip-chip and other passive optical packaging processes, identify and solve structural warpage, alignment offset, delamination failure and other issues in the packaging process, and cooperate with reliability testing and failure analysis (FMEA).
- Liaise with foundry packaging teams to release mass-production-ready structural drawings and process specifications, and follow up on the process quality of packaged prototypes.
- Track technical iterations in the passive optical packaging structure field, and complete technical pre-research and solution innovation for high-density all-optical connectivity packaging requirements.
SCOPE: Focus on passive optical package structure development for all-optical connectivity products
EDUCATION:
REQUIRED: Bachelor's degree or above in Mechanical Design, Electronic Packaging, Mechatronics or related fields
PREFERRED: None
WORK EXPERIENCE:
REQUIRED: 3+ years of R&D experience in packaging structure for optoelectronic devices/semiconductors
PREFERRED: None
SKILLS & ABILITIES:
REQUIRED:
- Bachelor's degree or above in Mechanical Design, Electronic Packaging, Mechatronics or related fields, with 3+ years of R&D experience in packaging structure for optoelectronic devices/semiconductors;
- Experience in silicon photonic packaging or passive optical engine packaging is preferred.
- Proficient in UG/NX/SolidWorks or other structural design software, master basic tolerance analysis and thermal simulation methods; familiarity with basic optical coupling simulation principles is preferred.
- Familiar with mainstream optical packaging processes such as COB, FC, SiP, and understand reliability test standards and failure analysis methods for optical device packaging.
- Excellent cross-team communication and problem-solving skills, with passion for all-optical connectivity packaging technology and rigorous working attitude.
PREFERRED:
- Experience in silicon photonic packaging or passive optical engine packaging is preferred
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