Job Description

We are seeking an experienced Senior Director of Engineering to join our team. This role involves active leadership in the concept and architecture development, design, integration, and delivery of complex multi-chip RFIC-based module solutions for 2-9 GHz wireless connectivity applications. The candidate will engage with all aspects of product realization, including interfacing with key customers and collaborating with cross-site teams to deliver high-performance RF products for high-volume markets.

The ideal candidate will have a strong RF design background with an excellent understanding of wireless markets and the IC and MCM technologies required to meet cutting-edge product demands. As a key leader in product development, you will ensure the consistent application of the latest design methodologies to facilitate high-quality, on-time product launches. This role also requires exceptional leadership and customer interaction skills.

Key Responsibilities

• Drive and manage RF product and IP development for TX/RX wireless modules, ensuring alignment with the marketing roadmap through regular team meetings and design reviews.
• Collaborate with multi-disciplinary teams across the company through the entire product lifecycle, including RF design, packaging, product engineering, and test engineering.
• Act as a key contributor to connectivity IP roadmap requirements, providing input for annual corporate planning.
• Partner with Marketing and customers to define product specifications and requirements comprehensively.
• Conduct timely architecture studies and feasibility simulations, factoring in cost and performance considerations.
• Ensure robust, bug-free product development by enforcing the use of the latest simulation methodologies, design checklists, and rigorous product performance tracking throughout the development cycle.
• Develop and lead a high-performance, world-class team, including hiring, coaching, mentoring, and fostering the growth of team members.
• Provide periodic status updates to senior management.
• Travel to customer sites and other company locations as required.

Required Qualifications

• Education and Experience:

  • Bachelor’s Degree in Electrical Engineering (BSEE) with 15+ years of related experience, or
  • Master’s Degree in Electrical Engineering (MSEE) with 12+ years of related experience.

• Skills and Expertise:

  • Proven success interfacing with Tier 1 customers and delivering high-quality products.
  • Extensive experience leading cross-functional product teams from concept to launch.
  • Strong leadership and communication skills, with a passion for excellence and the ability to thrive in a team-driven environment.
  • In-depth knowledge of RFIC components, including switches, LNAs, and PAs, as well as semiconductor process technologies (e.g., CMOS, GaAs/Silicon HBT, SOI, BiCMOS).
  • Proficiency in RF simulation tools such as ADS, Cadence, and EM tools
  • Expertise in RF measurement techniques and equipment, including spectrum analyzers and signal generators.
  • Demonstrated ability to lead product development, including the design and simulation of RF components using EM tools.
  • Strong knowledge of wireless communication standards such as Wi-Fi and LTE

Compensation and Benefits:

Starting base pay will be based on factors such as experience, skills, education, market demands, responsibilities, and location. The client offers a variety of base pay ranges for U.S. locations. Benefits include healthcare options (with a premium-free medical plan), a 401(k) plan with company match, an employee stock purchase plan, and paid time off (vacation, wellness days, and parental leave). Employees are also eligible for an incentive plan, and certain roles may qualify for additional awards, including recognition and stock options, based on individual and company performance.