About the Business Unit:
Ceva is at the forefront of the Smart Edge revolution, with innovative state-of-the-art Silicon and Software solutions that enable products to Connect, Sense and Infer.
Within the Wireless Internet of Things group, Ceva is offering you the chance to be a member of our Hardware Radio team in Athens, which was established after the acquisition of MEICSi by Ceva.
About the Role:
In this role, you will contribute to the development of next‑generation wireless communication technologies, including advanced MIMO Wi‑Fi and Bluetooth transceivers. You will join an innovative and highly skilled team responsible for digital RF design, working at the intersection of architecture, algorithms, hardware, software, and system engineering. Together, you will help shape state‑of‑the‑art connectivity solutions that power tomorrow’s connected devices.
Responsibilities:
Own the design and verification of digital blocks for advanced RF transceivers, ensuring high performance and robustness.
Collaborate closely with system, algorithms, and baseband teams to define specifications, interfaces, and functional requirements.
Develop clear and comprehensive technical documentation for the designed modules, including architecture, interfaces, and verification details.
Support post‑silicon bring‑up, verification, and validation activities in collaboration with cross‑functional teams to ensure successful product integration and performance.
Advantage:

Ceva is the leader in innovative silicon and software IP solutions
that enable smart edge products to connect, sense, and infer data more reliably and efficiently.
At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years.
With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 18 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva.
We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically.
Headquartered in Rockville, Maryland, Ceva has more than 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 17 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets.
Ceva was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.