职位描述

1. Conduct literature research and Design of Experiments (DoE) to support the development of SiC semiconductor die attach processes (e.g., sintering, soldering, embedding)；
2. Perform process development for power module-to-heatsink interconnection and evaluate new material& processes, including literature review, DoE design, and technical discussions with suppliers and partners.
Operate advanced packaging manufacturing equipment, including:
- Die bonding / pick & place systems
- Printing systems (e.g. paste, solder, sinter materials)
- Sintering equipment
- CNC machining and laser processing tools
3. Perform failure analysis and quality inspection using tools such as:
- CSAM (C-Scan Acoustic Microscopy)
- Optical microscopy and other characterization tools
- Generate structured technical reports and documentation
4. Support cleanroom setup, including equipment installation, qualification, and commissioning；
5. Investigate and develop new materials, processes, and technologies, and contribute to process roadmaps for next-generation power modules and other semiconductor application fileds；
6. Coordinate with external partners and suppliers, organize technical meetings, and prepare meeting minutes and progress reports.

职位要求

1. Master’s degree or higher in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or related fields;
2. 3–5 years of relevant industry or research experience in semiconductor processing or advanced packaging, strong semiconductor knowledge and background;
3. Strong self-motivation and a results-driven mindset; with strong curiosity and a passion for learning; demonstrates a proactive, ownership mindset with disciplined use of R&D resources and a strong ambition to deliver high-impact results and contribute to shaping the future of the industry;
4. Hands-on experience with manufacturing/prototyping equipment in semiconductor industry or semiconductor packaging is highly preferred, cleanroom working experience is a plus;
5. Experience in mechanical design, including: Engineering drawings Tolerance analysis Fixture/jig design Module/package design is a plus;
6. Fluent English is required as the working language;
7. Experience using AI agents/tools to increase working efficiency is a plus.