Job
Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes
Operate and optimize 2D/3D AOI systems and inspection parameters
Configure AOI inspection algorithms for new product designs
Set up process conditions and equipment configurations for new packages and production lines
Optimize reflow parameters and temperature profiles
Analyze solder/micro bump quality and implement improvements
Conduct root cause analysis and implement corrective actions for process issues
Support customer quality requirements through technical evaluation and documentation
Supports mass production and quality control in the advanced semiconductor packaging process
Contributes to defect reduction, process stability, and customer satisfaction
Drives yield and reliability improvements in AOI and reflow process areas
Requirement:
Bachelors degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)
Minimum 3 years of experience in AOI or reflow process in semiconductor backend
Ability to establish process conditions and optimize parameters
Strong data analysis and problem-solving skills
Proficient in writing technical documents and communicating in English
Knowledge of inspection or reflow/soldering principles
Experience in defect analysis and developing defect evaluation criteria
Required experience with bump and RDL inspection
Basic understanding of thermal, electrical, and material behavior in reflow processes
Experience in advanced packaging process such as 2.5D, fan-out and flip-chip
Familiarity with quality tools such as APQP, FMEA and 8D methodology
Experience in responding to customer quality requirements or certification audits
Ability to write technical documentation and communicate in English
Hand-on experience with major AOI equipment(e.g., KLA, onto, Camtek)
Collaborative experience in AOI image analysis and algorithm development
Experience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids.
Experience in quality and reliability evaluation related to reflow or soldering processes
Understanding of associated assembly/joining processes (eg. Bonding, chip attach)
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:
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